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Product Detailed Parameters
- Description:IC MCU 32BIT 512KB FLSH 144LFBGA
- Series:SAM E70
- Mfr:Microchip Technology
- Package:Tray
- Core Processor:ARM® Cortex®-M7
- Core Size:32-Bit Single-Core
- Speed:300MHz
- Connectivity:CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
- Peripherals:Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:114
- Program Memory Size:512KB (512K x 8)
- Program Memory Type:FLASH
- EEPROM Size:-
- RAM Size:256K x 8
- Voltage - Supply (Vcc/Vdd):1.7V ~ 3.6V
- Data Converters:A/D 24x12b; D/A 2x12b
- Oscillator Type:Internal
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:144-LFBGA (10x10)
- Package / Case:144-LFBGA
- Grade:-
- Qualification:-
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Overview
The ATSAME70Q19B-CFN is a 32-bit microcontroller from the Microchip SAM E70 series, featuring an ARM Cortex-M7 core operating at 300MHz. It integrates 512KB of flash memory and 256KB of SRAM within a 144-LFBGA (10x10) package. The device supports a supply voltage range of 1.7V to 3.6V and includes extensive connectivity options such as Ethernet, CANbus, USB, and various serial interfaces. It provides 114 I/O pins, 24-channel 12-bit ADCs, and two 12-bit DACs, designed for industrial applications with an operating temperature range of -40°C to 105°C.
Feature Summary
- High-performance processing via ARM Cortex-M7 core with integrated DSP and FPU capabilities
- Comprehensive peripheral set including Ethernet MAC, CAN-FD, and multiple communication interfaces
- Integrated analog front-end with high-resolution ADCs and DACs for signal processing
- Robust security features and memory protection units for reliable system operation
Applications
- Industrial automation and control systems
- Smart metering and utility infrastructure
- Medical equipment requiring precise analog signal acquisition
- Automotive infotainment and instrument clusters
Procurement Notes
Verify the specific suffix 'CFN' against the official Microchip datasheet to confirm the 144-LFBGA package and industrial temperature grade. Ensure compatibility with required PCB footprint dimensions and thermal management strategies. Cross-reference the latest errata sheet for any known silicon revisions or functional limitations relevant to this specific batch. Confirm RoHS compliance status through manufacturer documentation prior to integration.
Selection Notes
Select this component when high computational throughput is required alongside rich connectivity options in a compact form factor. It is suitable for designs needing significant on-chip memory for complex algorithms and real-time data processing. Consider the 144-pin LFBGA package constraints regarding PCB layout density and soldering requirements compared to QFP alternatives.
Part Context
This part belongs to the SAM E70 family, which targets high-performance embedded applications. It shares architectural similarities with the SAM S70 and SAM V70 series but offers specific interface combinations tailored for general-purpose industrial and commercial use. The E70 series emphasizes ease of development with comprehensive software support libraries.
Replacement Considerations
ATSAME70Q19A-CN is a documented alternative within the same family offering similar specifications in a different package variant.
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