ATSAMG55G19B-UNT

Description：WLCSP MRL B 105C TEMP T&R
Series：SAM G55
Mfr：Microchip Technology
Package：Tape & Reel (TR)
Core Processor：ARM® Cortex®-M4

SKU:8303caa77351 Category: Microcontrollers Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：WLCSP MRL B 105C TEMP T&R
Series：SAM G55
Mfr：Microchip Technology
Package：Tape & Reel (TR)
Core Processor：ARM® Cortex®-M4
Core Size：32-Bit Single-Core
Speed：120MHz
Connectivity：I2C, SPI, UART/USART, USB
Peripherals：DMA, I2S, POR, PWM, WDT
Number of I/O：38
Program Memory Size：512KB (512K x 8)
Program Memory Type：FLASH
EEPROM Size：-
RAM Size：176K x 8
Voltage - Supply (Vcc/Vdd)：1.62V ~ 3.6V
Data Converters：A/D 8x12b
Oscillator Type：Internal
Operating Temperature：-40°C ~ 105°C (TA)
Mounting Type：Surface Mount
Supplier Device Package：49-WLCSP (2.84x2.84)
Package / Case：49-UFBGA, WLCSP
Grade：-
Qualification：-

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ATSAMG55G19B-UNT

Overview

The ATSAMG55G19B-UNT is a 32-bit ARM Cortex-M4 microcontroller featuring a Floating Point Unit (FPU) and DSP instructions. It operates at a maximum clock frequency of 120 MHz with up to 512 Kbytes of embedded Flash memory and 160 Kbytes of SRAM plus up to 16 Kbytes on the I/D bus. The device includes an 8-channel 12-bit ADC, two I2S controllers, one PDM interface, and USB 2.0 Full Speed capabilities. It supports industrial temperatures from -40°C to +85°C and utilizes a 49-ball WLCSP package.

Feature Summary

High-performance processing via ARM Cortex-M4 core with FPU and DSP support
Integrated crystal-less USB 2.0 Device and Host OHCI functionality
Rich peripheral set including dual I2S controllers and Pulse Density Modulation interface
Flexible low-power management with Sleep, Wait, and Backup modes

Applications

Consumer electronics devices
Industrial control systems
PC peripherals
Audio applications utilizing I2S and PDM interfaces

Procurement Notes

Verify the specific ordering suffix 'B' corresponds to the required carrier type and temperature range as defined in the manufacturer's official ordering table. Confirm that the 49-ball WLCSP package dimensions align with the target PCB layout constraints. Ensure compatibility with the intended programming and debugging interfaces before finalizing procurement specifications.

Selection Notes

Select this component for designs requiring high computational performance combined with audio connectivity features like I2S and PDM. The inclusion of USB OHCI allows for host capabilities without external transceivers. Consider the 49-ball WLCSP package size if board real estate is limited compared to QFN or LQFP alternatives within the same series.

Part Context

This part belongs to the SAM G55 series of microcontrollers based on the ARM Cortex-M4 architecture. The series offers a balance of processing power and low power consumption suitable for various embedded applications. The G19 variant specifically denotes the configuration with 512 Kbytes of Flash and 160 Kbytes of SRAM in the WLCSP package.