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ATSAMS70Q19A-CNT
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Product Detailed Parameters
- Description：IC MCU 32BIT 512KB FLSH 144LFBGA
- Series：SAM S70
- Mfr：Microchip Technology
- Package：Tape & Reel (TR),Cut Tape (CT)
- Core Processor：ARM® Cortex®-M7
- Core Size：32-Bit Single-Core
- Speed：300MHz
- Connectivity：EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
- Peripherals：Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O：114
- Program Memory Size：512KB (512K x 8)
- Program Memory Type：FLASH
- EEPROM Size：-
- RAM Size：256K x 8
- Voltage - Supply (Vcc/Vdd)：1.08V ~ 3.6V
- Data Converters：A/D 24x12b; D/A 2x12b
- Oscillator Type：Internal
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：144-LFBGA (10x10)
- Package / Case：144-LFBGA
- Grade：-
- Qualification：-
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Overview
The ATSAMS70Q19A-CNT is a 32-bit microcontroller from the SAM S70 series, featuring an ARM Cortex-M7 core operating at 300MHz. It integrates 512KB of flash memory and 256KB of SRAM within a 144-pin UFBGA package. The device supports a supply voltage range of 1.08V to 3.6V and includes 24-channel 12-bit ADCs and two 12-bit DACs. Connectivity options encompass Ethernet, CAN-FD, USB, SPI, I2C, UART, and QSPI interfaces.
Feature Summary
- High-performance processing via ARM Cortex-M7 core with integrated DSP and FPU capabilities
- Integrated analog front-end with multiple high-resolution ADC channels and DAC outputs
- Comprehensive peripheral set including Ethernet MAC, CAN-FD, and various serial communication interfaces
Applications
- Industrial automation controllers requiring real-time processing
- Human-machine interface (HMI) displays in industrial environments
- Smart metering systems with analog signal acquisition needs
- Automotive infotainment and instrument cluster applications
Procurement Notes
Verify the specific suffix 'CNT' against official Microchip documentation to confirm tape-and-reel packaging and any distinct temperature or grade variations compared to standard tray versions. Ensure compatibility with existing PCB footprints for the 144-UFBGA package. Confirm moisture sensitivity level requirements during assembly processes.
Selection Notes
Select this component when a balance of high-speed processing and extensive connectivity is required within a compact footprint. Compare against ATSAME70 variants if Ethernet or CAN-FD support is not needed, or consider ATSAMS70N20A-CN for larger memory capacities in a different package type. Evaluate power consumption profiles against application requirements.
Part Context
This part belongs to the SAM S70 family, which shares architectural similarities with the SAM E70 and SAM V70 families. These devices are designed for high-performance embedded applications, offering robust security features and extensive peripheral integration suitable for complex control tasks.
Replacement Considerations
ATSAMS70Q19B-CN offers similar specifications but may include CAN-FD support as indicated in related datasheets. ATSAME70Q19A-CN is a comparable device within the same package but lacks certain S70-specific features like CAN-FD.
