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Product Detailed Parameters
- Description：IC MCU 8/16BIT 64KB FLASH 64QFN
- Series：AVR® XMEGA® D3
- Mfr：Microchip Technology
- Package：Tray
- Core Processor：AVR
- Core Size：8/16-Bit
- Speed：32MHz
- Connectivity：I2C, IrDA, SPI, UART/USART
- Peripherals：Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O：50
- Program Memory Size：64KB (32K x 16)
- Program Memory Type：FLASH
- EEPROM Size：2K x 8
- RAM Size：4K x 8
- Voltage - Supply (Vcc/Vdd)：1.6V ~ 3.6V
- Data Converters：A/D 16x12b
- Oscillator Type：Internal
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：64-QFN (9x9)
- Package / Case：64-VFQFN Exposed Pad
- Grade：-
- Qualification：-
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Overview
The ATXMEGA64D3-MN is an 8-bit microcontroller from the AVR XMEGA D3 series, manufactured by Microchip Technology. It features a 64 kB Flash program memory, 2 kB EEPROM, and 4 kB SRAM. The device operates on a supply voltage range of 1.6 V to 3.6 V and supports a maximum clock frequency of 32 MHz. It utilizes a 64-pin QFN package with an industrial temperature rating of -40°C to +85°C.
Feature Summary
- Integrates a high-performance 8-bit AVR RISC core capable of executing complex instructions in single clock cycles.
- Includes a versatile event system for direct peripheral-to-peripheral communication without CPU intervention.
- Features multiple communication interfaces including USART, SPI, and TWI for flexible connectivity.
- Provides a 12-bit analog-to-digital converter with up to 16 channels for precise signal acquisition.
Applications
- Industrial control systems requiring robust data processing
- Building automation and climate control units
- Utility meters with RF or ZigBee connectivity
- Thermostats with display interfaces
Procurement Notes
Verify component authenticity through authorized Microchip distributors. Confirm package integrity and pin alignment against datasheet specifications. Ensure storage conditions comply with moisture sensitivity level requirements. Validate that the specific suffix matches the required thermal and packaging standards for your assembly process.
Selection Notes
Select this model when a balance of moderate memory capacity and low power consumption is required. The D3 series is suitable for applications needing fast wake-up times and extensive I/O options. Consider the QFN package constraints for PCB layout and thermal management during the design phase.
Part Context
This component belongs to the AVR XMEGA D3 family, designed for general-purpose embedded applications. It shares architectural similarities with other D3 variants but offers specific memory and package configurations. The family emphasizes picoPower technology for extended battery life in portable devices.
Replacement Considerations
Consult official substitution lists for compatible parts within the XMEGA D3 series. Verify pin compatibility and electrical characteristics before replacing. Cross-reference datasheets to ensure equivalent performance metrics and interface support.
