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AW611HN/A1AK is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is AW611HN/A1AK. Review the specifications below when checking this part for your BOM.
The AW611HN/A1AK is a highly integrated automotive-grade system-on-chip combining 2.4/5 GHz dual-band Wi-Fi 6 (802.11ax) and Bluetooth/BLE 5.4. It features a 1x1 RF architecture with an integrated power amplifier, low-noise amplifier, and transceiver, eliminating the need for external front-end modules. The device supports SDIO and UART interfaces for host connectivity and includes dedicated CPUs and memory for independent protocol processing. Certified to AEC-Q100 Grade 3 (-40°C to +85°C) and Grade 2 (-40°C to +105°C), it enables efficient coexistence with LTE and other external radios while minimizing bill-of-materials complexity.
Verify that the specific suffix A1AK matches the required pinout and configuration for your design, as ordering suffixes may denote package or testing variations. Confirm AEC-Q100 grade requirements against your thermal environment; this part supports both Grade 2 and Grade 3 ratings depending on the specific variant's qualification status. Ensure your host processor supports the necessary SDIO or UART interface protocols for proper driver integration and data throughput.
Select this component when a single-chip solution for automotive Wi-Fi 6 and Bluetooth is required to reduce BOM size and cost. It is suitable for designs needing integrated RF front-end components to save board space. Choose this part if your application demands certified automotive reliability across wide temperature ranges. Consider the supported interfaces (SDIO/UART) to ensure compatibility with your chosen application processor.
This part belongs to NXP's AW611 family of automotive wireless connectivity solutions. The AW611 series is designed specifically for the automotive market, offering high integration levels to simplify hardware design. It represents a generation of chips that combine Wi-Fi 6 and Bluetooth 5.x capabilities into a single silicon die, targeting next-generation vehicle connectivity needs.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing designs before considering alternative sources.
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