AX8052F100-3-WD1

AX8052F100-3-WD1

  • Description:IC MCU 8BIT 64KB FLASH WAFER
  • Series:-
  • Mfr:onsemi
  • Package:Bulk
  • Core Processor:8052

SKU:63dca41c8397 Category: Brand:

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Product Detailed Parameters

  • Description:IC MCU 8BIT 64KB FLASH WAFER
  • Series:-
  • Mfr:onsemi
  • Package:Bulk
  • Core Processor:8052
  • Core Size:8-Bit
  • Speed:20 MIPS
  • Connectivity:SPI, UART/USART
  • Peripherals:Brown-out Detect/Reset, Crypto - AES, DMA, POR, PWM, TRNG, WDT
  • Number of I/O:24
  • Program Memory Size:64KB (64K x 8)
  • Program Memory Type:FLASH
  • EEPROM Size:-
  • RAM Size:8.25K x 8
  • Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
  • Data Converters:A/D 8x10b
  • Oscillator Type:Internal
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Supplier Device Package:Wafer
  • Package / Case:Die
  • Grade:-

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AX8052F100-3-WD1

Overview

The AX8052F100-3-WD1 is an ultra-low power RF microcontroller system-on-chip (SoC) from onsemi, designed for wireless communication applications. It integrates a 20.2 MHz 8-bit 8052 core with 64 kB of flash memory and 8.25 kB of RAM. The device supports multiple modulation schemes including ASK, FSK, MSK, and PSK, operating within the 27–1050 MHz RF carrier frequency range. It features a built-in AES crypto engine, true random number generator, and various peripherals such as UARTs, SPI ports, and ADCs. The component operates on a supply voltage between 1.8 V and 3.6 V DC across a temperature range of -40 °C to +85 °C.

Feature Summary

  • Integrates an ultra-low power 8-bit 8052 MCU core with embedded flash and RAM for efficient code execution in wireless systems.
  • Includes dedicated hardware security features such as an AES crypto engine and a true random number generator for secure communications.
  • Supports advanced narrow-band RF transmission with internal TX/RX switching capabilities for single-ended or dipole antenna configurations.

Applications

  • Wireless sensor networks requiring low standby power consumption
  • Remote control and monitoring systems using ASK, FSK, MSK, or PSK modulation
  • Industrial automation devices operating within wide temperature ranges

Procurement Notes

Verify the specific suffix WD1 against official datasheets to confirm package type and tape-and-reel specifications. Ensure compatibility with required RF frequencies and modulation standards. Cross-reference ordering information with authorized distributors to avoid counterfeit components. Confirm that the selected variant meets all environmental and electrical requirements for the intended application environment.

Selection Notes

Select this SoC when a combined MCU and RF transceiver solution is needed to reduce board space and component count. Consider its low power modes for battery-operated devices. Evaluate the integrated peripherals like timers and ADCs to minimize external component dependencies. Verify that the 8052 instruction set aligns with existing software development resources and toolchains.

Part Context

This part belongs to the AX8052F100 series of ultra-low power RF microcontrollers. It is distinct from other variants by its specific pinout and packaging configuration indicated by the suffix. The series is designed to simplify wireless design by integrating baseband processing and RF front-end control into a single chip, reducing complexity compared to discrete solutions.

Replacement Considerations

Direct substitutes include other parts within the AX8052F100 family, such as AX8052F100-2-TA05, provided pinouts and package dimensions are compatible. Verify functional equivalence regarding memory size, peripheral availability, and RF performance before substitution.

AX8052F100-3-WD1AX8052F100-3-WD1

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