SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AZ23B20-HE3-08 is a silicon planar Zener diode array manufactured by Vishay General Semiconductor - Diodes Division. It features a dual common anode configuration housed in an SOT-23 surface-mount package. The nominal Zener voltage is 20 V with a tight tolerance of ±2%. Electrical characteristics include a maximum reverse leakage current of 50 nA at 15 V and a dynamic resistance of 220 Ω measured at a test current of 5 mA. The device supports a power dissipation of up to 500 mW, operates within a temperature range of -55 °C to +150 °C, and complies with RoHS standards.
Verify the specific ordering code suffix against the manufacturer's documentation to confirm tape-and-reel specifications and packaging dimensions. Ensure that the procurement channel sources genuine components directly from authorized distributors or the manufacturer to guarantee compliance with RoHS directives and AEC-Q101 automotive standards.
Select this component when a precise 20 V reference with strict ±2% tolerance is required in a compact SOT-23 footprint. The dual common anode structure allows for efficient space utilization in multi-channel designs. Consider the thermal resistance parameters if operating near the maximum junction temperature limits.
This part belongs to the AZ23 series of small signal Zener diodes. The 'B' designation indicates the tighter ±2% voltage tolerance compared to the standard ±5% 'C' variant. The 'HE3' suffix denotes a lead-free, halogen-free, and green-compliant product formulation suitable for environmentally conscious manufacturing processes.
AZ23B20-E3-08
The device provides an ESD capability greater than 8 kV according to the human body model and greater than 800 V according to the machine model, as per AEC-Q101 standards.
The HE3 suffix indicates a lead-free, halogen-free, and green-compliant material composition. It does not alter the fundamental electrical characteristics or pinout compared to other variants in the same series.
When mounted on an FR-4 board with the recommended soldering footprint, the maximum power dissipation is rated at 300 mW.