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The AZ23C16_R1_00001 is a dual surface mount Zener diode from the AZ23C2V4 series manufactured by Panjit. It features a common anode configuration within an SOT-23 package, suitable for automatic insertion. The nominal Zener voltage is 16 V with a tolerance range of 15.20 V to 16.80 V at a test current of 5 mA. Maximum power dissipation is rated at 300 mW, and thermal resistance from junction to ambient air is 417 °C/W. Electrical characteristics include a maximum Zener impedance of 40 Ω at 5 mA and a maximum reverse leakage current of 0.1 μA at 12 V. The device operates within a temperature range of -55 °C to +150 °C.
Verify component authenticity through official manufacturer channels or authorized distributors. Confirm that the received parts match the specific marking code D20 associated with this part number. Ensure compliance with environmental directives such as RoHS and halogen-free requirements if applicable to your manufacturing process. Cross-reference datasheet revisions to ensure electrical parameters align with your design specifications.
Select this component when a dual Zener solution in a compact SOT-23 package is required. The common anode configuration simplifies circuit layout compared to discrete single diodes. Consider the 300 mW power dissipation limit and thermal resistance when designing heat management strategies. Verify that the 16 V nominal voltage fits within the required operating window of your application.
This component belongs to the AZ23C2V4 series, which offers dual Zener diodes with voltages ranging from 2.4 V to 51 V. All members of this series share the same SOT-23 mechanical footprint and common anode topology. The series provides various marking codes corresponding to different voltage ratings, facilitating easy identification during assembly and inspection processes.
Direct replacements must maintain the dual common anode configuration and SOT-23-3 package. Verify that substitute components offer equivalent Zener voltage tolerances and power dissipation ratings. Check for compatibility with existing PCB pad layouts and automated placement equipment constraints.