SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AZ23C3V9-HE3-08 is a dual common anode silicon planar Zener diode array manufactured by Vishay General Semiconductor - Diodes Division. It features a nominal Zener voltage of 3.9 V with a ±5% tolerance, tested at a current of 5 mA. The device has a maximum reverse leakage current of 3 μA and a dynamic resistance of 90 Ω at the test current. It operates within a temperature range of -55 °C to +150 °C and dissipates up to 300 mW on an FR-4 board. The component is AEC-Q101 qualified and housed in a SOT-23 package.
Verify the specific ordering code suffix against the manufacturer's official documentation to confirm compliance requirements. Ensure that the procurement channel sources components directly from authorized distributors or the manufacturer to guarantee authenticity. Cross-reference the part number with the latest datasheet revision to validate electrical parameters before finalizing purchase orders.
Select this component when a dual Zener array with a 3.9 V nominal voltage and ±5% tolerance is required. The choice is appropriate for designs needing AEC-Q101 automotive qualification and high ESD protection levels. Consider the SOT-23 package dimensions and thermal dissipation limits relative to the available PCB footprint and ambient operating temperatures.
This device belongs to the AZ23 series of small signal Zener diodes produced by Vishay Semiconductors. The series offers a wide range of Zener voltages graded according to the international E24 standard. The HE3_A suffix indicates RoHS-compliant materials and AEC-Q101 qualification, distinguishing it from commercial grade variants.
AZ23C3V9-HE3_A-08
The device provides an ESD capability of greater than 8 kV according to the human body model and greater than 800 V according to the machine model, as specified in the AEC-Q101 qualification.
The 'C' in the ordering code indicates a standard Zener voltage tolerance of ±5%. Replacing 'C' with 'B' would result in a tighter ±2% tolerance specification.
When mounted on an FR-4 board with the recommended soldering footprint, the maximum power dissipation is rated at 300 mW.