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The AZ23C5V6-7-F is a dual surface mount Zener diode from Diodes Incorporated, housed in an SOT-23 package. It features a common anode configuration with a maximum power dissipation of 300 mW. The nominal Zener voltage ranges from 5.2 V to 6.0 V at a test current of 5.0 mA. Maximum Zener impedance is 40 Ω at IZT and 400 Ω at IZK. The typical temperature coefficient is +0.020 %/°C, and the minimum reverse voltage is 1.0 V. Operating and storage temperatures range from -65 °C to +150 °C.
Verify the specific ordering suffix when sourcing components. The standard commercial version utilizes the -7-F suffix, while automotive-grade variants require the Q-7-F suffix. Confirm that the procurement channel provides original manufacturer documentation to ensure component authenticity and traceability before finalizing acquisition.
Select this component for designs requiring two independent Zener references sharing a common ground connection. Evaluate the thermal resistance characteristics against the expected ambient temperature conditions. Ensure the circuit design accommodates the specified leakage current and impedance values to maintain signal integrity under varying load conditions.
This device belongs to the AZ23C series of dual surface mount Zener diodes manufactured by Diodes Incorporated. The series spans various voltage ratings from 2.7 V to 51 V, all utilizing the same SOT-23 footprint. This specific part number represents the 5.6 V nominal variant within the broader product family.
The DZ23C5V6-7-F serves as the common cathode equivalent within the same manufacturer's lineup. Cross-referencing requires verifying pinout compatibility and ensuring the alternative configuration matches the circuit topology requirements.
The device contains two Zener diodes connected in a common anode configuration.
The typical temperature coefficient is +0.020 %/°C, indicating a slight positive drift in voltage as temperature increases.
Yes, the molded plastic package and lead-free terminals are designed to withstand mechanical stress and are ideally suited for automated assembly processes.