AZ23C6V2-E3-18

Overview

The AZ23C6V2-E3-18 is a silicon planar Zener diode array from Vishay Semiconductors, housed in an SOT-23 package. It features a dual common-anode configuration with a nominal Zener voltage of 6.2 V and a tolerance of ±5%. The device operates at a test current of 5 mA, with a maximum reverse leakage current of 1 µA at 4 V and a dynamic resistance of 10 Ω. It supports a power dissipation of up to 500 mW and functions within a temperature range of -55 °C to +150 °C.

Feature Summary

• Dual common-anode Zener diode array for compact circuit integration
• Silicon planar construction ensuring stable voltage regulation
• High electrostatic discharge protection capability

Applications

• Voltage reference circuits requiring dual regulated rails
• Clamping and protection stages in signal processing paths
• Overvoltage suppression in low-power electronic modules

Procurement Notes

Verify the specific ordering code suffix against project requirements. Confirm that the standard commercial grade designation aligns with environmental compliance standards. Ensure the reel quantity matches production needs. Validate component authenticity through authorized distribution channels before assembly.

Selection Notes

Select this variant when a precise 6.2 V breakdown voltage with ±5% tolerance is required. The common-anode topology simplifies biasing compared to independent diodes. Verify thermal management capabilities if operating near the maximum power dissipation limit under continuous load conditions.

Part Context

This component belongs to the AZ23 series of small signal Zener diodes manufactured by Vishay General Semiconductor. The series offers a wide range of graded voltages according to the E24 standard. The 'E3' suffix indicates RoHS compliance for commercial applications, while the '-18' suffix specifies tape-and-reel packaging for automated surface-mount assembly.

Replacement Considerations

Direct replacements include other AZ23C6V2 variants such as AZ23C6V2-G3-18 or AZ23C6V2-E3-08, provided the packaging format meets inventory constraints. Cross-brand equivalents must be evaluated for pinout compatibility and electrical parameter matching.