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The AZ23C9V1-HE3-08 is a dual common-anode Zener diode array manufactured by Vishay General Semiconductor - Diodes Division. It utilizes silicon planar technology and is housed in an SOT-23 surface-mount package. The nominal Zener voltage is 9.1 V with a tolerance of ±5 %. Electrical characteristics include a maximum reverse leakage current of 0.1 μA at 7 V, a dynamic resistance of 10 Ω at a test current of 5 mA, and a temperature coefficient ranging from 5 to 8 x 10⁻⁴/°C. The device is AEC-Q101 qualified for automotive applications and supports an operating temperature range from -55 °C to +150 °C.
Verify the specific ordering suffix against official documentation to confirm compliance requirements. The HE3_A suffix indicates RoHS compliance and AEC-Q101 qualification. Confirm that the tape-and-reel packaging matches the required quantity specifications for production integration. Ensure compatibility with standard surface-mount assembly processes.
Select this component when a dual-channel voltage regulation solution is required in a minimal footprint. The common-anode topology allows for shared ground connections, simplifying PCB layout. Verify that the 9.1 V nominal voltage aligns with the target circuit design parameters. Consider the thermal resistance values when designing for high ambient temperatures or limited board space.
This part belongs to the AZ23 series of small signal Zener diodes produced by Vishay Semiconductors. The series offers a wide range of graded Zener voltages according to the international E24 standard. Variants are available with different tolerances and packaging options to suit diverse commercial and industrial application needs.
AZ23C9V1-HE3_A-18
The device provides an ESD capability exceeding 8 kV according to the human body model and greater than 800 V according to the machine model, as specified under AEC-Q101.
The 'C' in the ordering code indicates a standard Zener voltage tolerance of ±5 %. Replacing 'C' with 'B' would result in a tighter tolerance of ±2 %.
When mounted on an FR-4 board using the recommended soldering footprint, the maximum power dissipation is rated at 300 mW.