Balun B0225J7575AHF product image

B0225J7575AHF

$0.61
  • Description:BALUN 200MHZ-2.5GHZ 75/75 0805
  • Series:Xinger®
  • Mfr:TTM Technologies, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:cb2d1ba3546e Category: Brand:

  
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B0225J7575AHF is listed in the Balun range at ChipApex. The manufacturer field lists TTM Technologies, Inc.. Its product description is BALUN 200MHZ-2.5GHZ 75/75 0805. Review the specifications below when checking this part for your BOM.

Balun specifications for B0225J7575AHF

  • Description:BALUN 200MHZ-2.5GHZ 75/75 0805
  • Series:Xinger®
  • Mfr:TTM Technologies, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:200MHz ~ 2.5GHz
  • Impedance - Unbalanced/Balanced:75 / 75Ohm
  • Phase Difference:40°
  • Insertion Loss (Max):1.2dB
  • Return Loss (Min):14dB
  • Package / Case:0805 (2012 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for B0225J7575AHF

B0225J7575AHF

Balun Overview

The B0225J7575AHF is an RF balun transformer manufactured by TTM Technologies, Inc. under the Xinger series. It operates within a frequency range of 200 MHz to 2.5 GHz and provides impedance transformation between 75 Ohm unbalanced and 75 Ohm balanced ports. The component features a maximum insertion loss of 1.2 dB and a minimum return loss of 14 dB. It utilizes a surface mount (SMD/SMT) installation type in a 0805 (2012 metric) package. The device supports board mounting and functions within a temperature range of -55°C to +85°C.

Balun Feature Summary

  • Provides signal conversion between unbalanced and balanced transmission lines
  • Supports wideband operation across the 200 MHz to 2.5 GHz spectrum
  • Designed for ultra-low profile surface mount integration

Balun Applications

  • RF front-end circuitry in wireless communication systems
  • Signal conditioning in broadband data transmission interfaces
  • Balanced-to-unbalanced matching in antenna feed networks

Balun Procurement Notes

Verify that the specific order matches the manufacturer part number B0225J7575AHF from TTM Technologies. Confirm the required packaging format, such as cut tape or reel, aligns with production needs. Ensure compliance with RoHS specifications and check the moisture sensitivity level (MSL 1) for proper storage and handling procedures before soldering.

Balun Selection Notes

Select this component when a 75 Ohm to 75 Ohm impedance match is required over a broad RF bandwidth. The 0805 footprint offers space efficiency for dense PCB layouts. Consider the 1.2 dB insertion loss specification for power budget calculations. Verify thermal requirements against the -55°C to +85°C operating range for the intended environment.

Balun Part Context

This balun belongs to the Xinger family of passive RF components produced by TTM Technologies. These devices are engineered for high reliability in mission-critical applications. The product line emphasizes miniaturization and consistent electrical performance across various industrial and commercial sectors.

Balun Replacement Considerations

Cross-reference alternative baluns with identical 75/75 Ohm impedance ratios and compatible 0805 footprints. Ensure substitute parts meet the 200 MHz to 2.5 GHz frequency coverage and similar insertion loss limits.

B0225J7575AHFB0225J7575AHF
$0.61
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