B028LB7S-T

Overview

The B028LB7S-T is a surface mount bandpass filter manufactured by Knowles Dielectric Labs. It operates at a center frequency of 2.8 GHz with a bandwidth of 200 MHz. The component features an insertion loss of 2.5 dB and is designed for board mounting in SMD/SMT configurations. It utilizes a 14-SMD, no lead package format. The device is supplied in a reel packaging type.

Feature Summary

• Surface mount bandpass filter design
• High-frequency signal conditioning capability
• Shielded construction for performance stability

Applications

• Wireless communication systems
• RF signal processing circuits
• Base station equipment filtering

Procurement Notes

Verify the specific datasheet revision and RoHS compliance status directly with the manufacturer or authorized distributors before procurement. Confirm that the reel packaging quantity matches production requirements. Ensure compatibility with standard SMD assembly processes and check for any regional distribution restrictions or supply limitations that may affect availability.

Selection Notes

Select this component when a 2.8 GHz center frequency and 200 MHz bandwidth are required for surface mount applications. Consider the 2.5 dB insertion loss specification for system link budget calculations. Verify that the 14-SMD package dimensions fit the PCB layout constraints. Ensure the operating temperature range meets the environmental conditions of the intended deployment scenario.

Part Context

This part belongs to the Knowles Dielectric Labs signal conditioning portfolio, specifically within their surface-mount bandpass filter series. These components utilize low-loss, high-permittivity ceramics to provide minimal performance variation over temperature. The product line is fully shielded and offers excellent repeatability for high-frequency attenuation applications.

Replacement Considerations

Consult official substitution guides for compatible alternatives. Cross-reference electrical specifications such as center frequency, bandwidth, and insertion loss to ensure functional equivalence. Verify package compatibility and thermal characteristics before implementing any substitute component.