B0922J7575A50HF

Balun Overview

The B0922J7575A50HF is an ultra-low profile balun manufactured by TTM Technologies under the Xinger brand. It operates within a frequency range of 950 MHz to 2.15 GHz and supports 75 Ohm to 75 Ohm impedance transformation. The component utilizes SMD/SMT mounting in an 0805 (2012 metric) package. It functions reliably across a temperature range of -55°C to +85°C.

Balun Feature Summary

• Ultra-low profile design for space-constrained applications
• Balanced-to-balanced signal conversion
• Surface-mount construction

Balun Applications

• Wireless communication systems
• RF signal conditioning circuits
• Industrial instrumentation

Balun Procurement Notes

Verify the specific datasheet version and RoHS compliance status directly with TTM Technologies or authorized distributors before procurement. Confirm that the 0805 footprint matches your PCB layout requirements. Ensure the operating temperature range aligns with your system's environmental conditions.

Balun Selection Notes

Select this component when balanced-to-balanced conversion is required in the 950 MHz to 2.15 GHz band. The 0805 package size offers a compact solution for surface-mount assembly. Consider the ultra-low profile characteristic if vertical clearance is limited in the design.

Balun Part Context

This part belongs to the Xinger series of RF components produced by TTM Technologies. It is categorized as a signal conditioning device, specifically a balun transformer. The product line focuses on providing reliable RF solutions for various electronic applications.

Balun Replacement Considerations

The B0922N7575AHF is a similar balun from the same manufacturer but uses a 0404 package. Verify mechanical compatibility and electrical specifications before substitution.