B0922J7575AHF

Balun Overview

The B0922J7575AHF is an ultralow profile balun transformer manufactured by TTM Technologies under the Xinger brand. It operates within a frequency range of 200 MHz to 2.5 GHz and supports 75/75 Ohm impedance configuration. The component utilizes an 0805 (2012 metric) surface-mount package, ensuring board mounting compatibility. Key electrical specifications include a maximum insertion loss of 1.2 dB, a minimum return loss of 14 dB, and a phase difference of 40 degrees. It functions reliably across a temperature range of -55°C to +85°C.

Balun Feature Summary

• Provides signal conversion between balanced and unbalanced lines in RF circuits
• Features an ultralow profile design suitable for space-constrained applications
• Supports wideband operation from 200 MHz to 2.5 GHz
• Utilizes standard 0805 surface-mount packaging for automated assembly

Balun Applications

• RF front-end modules requiring impedance transformation
• Wireless communication systems operating in VHF/UHF bands
• Test and measurement equipment signal conditioning
• Industrial instrumentation RF interfaces

Balun Procurement Notes

Verify the specific ordering suffix and RoHS compliance status directly with the manufacturer or authorized distributors before procurement. Confirm that the 0805 footprint matches your PCB layout requirements. Ensure the selected supplier provides valid traceability documentation and adheres to the specified handling guidelines for sensitive surface-mount components during storage and installation.

Balun Selection Notes

Select this component when a 75-ohm balanced-to-unbalanced transition is required within the 200 MHz to 2.5 GHz spectrum. Consider the 0805 package size for density constraints and verify that the 1.2 dB insertion loss meets system budget requirements. Evaluate thermal performance against the -55°C to +85°C operational range to ensure reliability in the intended environment.

Balun Part Context

This part belongs to the Xinger series of passive RF components produced by TTM Technologies. The series focuses on miniaturized signal conditioning devices designed for modern electronic applications. Baluns in this lineup are engineered to maintain signal integrity while reducing the physical footprint on printed circuit boards, supporting trends toward compact wireless device designs.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify pinout compatibility and electrical parameter tolerances if considering alternative manufacturers. Consult official cross-reference lists from TTM Technologies for validated replacements.