B127MB2S-T

Overview

The B127MB2S-T is a surface mount bandpass filter manufactured by Knowles Dielectric Labs, designed for signal conditioning applications. It operates at a center frequency of 12.75 GHz with a bandwidth of 1 GHz. The component features a 50 Ohm impedance and an insertion loss of 3 dB. It utilizes SMD/SMT termination types for board mounting and functions within a temperature range of -55°C to +125°C. The device is part of the Bandpass series and is supplied in reel packaging.

Feature Summary

• Surface mount construction for direct board integration
• High-frequency operation at 12.75 GHz
• Temperature stable dielectric material design

Applications

• Satellite communication systems
• Microwave circuit designs
• Millimeter wave components

Procurement Notes

Verify the specific datasheet version for the B127MB2S-T to confirm current electrical tolerances and mechanical dimensions. Ensure compatibility with existing RF layout requirements before finalizing procurement decisions. Cross-reference official manufacturer documentation for any recent updates to the product specifications or environmental compliance status.

Selection Notes

Select this component for high-frequency applications requiring precise bandpass filtering at 12.75 GHz. Consider the 1 GHz bandwidth and 3 dB insertion loss characteristics when designing matching networks. Verify that the surface mount package aligns with the target PCB footprint and assembly capabilities.

Part Context

This model belongs to the Knowles Dielectric Labs microwave product portfolio, which utilizes proprietary thick film technology. The brand provides specialized RF and microwave components engineered for demanding environments. The B127MB2S-T represents a surface mount variant within their broader bandpass filter lineup.

Replacement Considerations

The B127MB2S-T is the tape-and-reel version of the B127MB2S bulk pack component. Both share identical electrical specifications and physical dimensions. Designers may substitute between these packaging variants based on manufacturing assembly preferences without altering circuit performance.