B138LA2S-T

Overview

The B138LA2S-T is a surface mount bandpass filter manufactured by Knowles Dielectric Labs. It operates at a center frequency of 13.75 GHz with a bandwidth of 500 MHz. The component features an insertion loss of 3.25 dB and a maximum height of 0.098 inches (2.49 mm). Designed for signal conditioning, it utilizes SMD/SMT termination types and supports board mounting applications within the RF filter category.

Feature Summary

• Surface mount construction for automated assembly integration
• Bandpass filtering capability centered at 13.75 GHz
• Compact physical profile suitable for space-constrained designs

Applications

• RF signal conditioning circuits
• Microwave communication systems
• Embedded wireless modules

Procurement Notes

Verify availability status directly with authorized distributors as supply may be restricted. Confirm lead times and minimum order quantities prior to ordering. Ensure compatibility with existing PCB footprints and reflow soldering profiles. Request updated datasheets to validate current manufacturing revisions and compliance certifications before finalizing procurement plans.

Selection Notes

Select this component when a 13.75 GHz center frequency with 500 MHz bandwidth is required. Verify that the 3.25 dB insertion loss meets system link budget requirements. Ensure the surface mount package dimensions fit the designated board area. Confirm impedance matching and thermal management needs align with the filter's specifications.

Part Context

This part belongs to the Knowles Dielectric Labs bandpass filter series. It shares family characteristics such as surface mount technology and signal conditioning functions with other models in the lineup. Specific performance metrics like frequency and loss distinguish it from adjacent variants within the manufacturer's portfolio.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Evaluate alternative components based on identical electrical parameters and mechanical footprint compatibility.