B207LA0S

Overview

The B207LA0S is a surface-mount bandpass filter manufactured by Knowles Dielectric Labs, designed for signal conditioning applications in the microwave spectrum. It operates with a center frequency of 20.7 GHz and provides a bandwidth of 1 GHz. The component features an insertion loss of 3.5 dB and maintains a system impedance of 50 Ohms. It supports a wide operating temperature range from -55°C to +125°C and utilizes SMD/SMT termination types for board mounting.

Feature Summary

• Provides precise bandpass filtering at 20.7 GHz with 1 GHz bandwidth
• Supports high-temperature operation up to 125°C
• Designed for surface-mount board integration

Applications

• Microwave communication systems
• Signal conditioning circuits
• RF front-end modules

Procurement Notes

Verify the specific suffix requirements when ordering, as tape-and-reel variants such as B207LA0S-T exist within the same product family. Confirm that the bare part number corresponds to the bulk packaging configuration required for your assembly process. Ensure compatibility with standard SMD reflow profiles given the ceramic substrate construction.

Selection Notes

Select this component for designs requiring a fixed 20.7 GHz center frequency with a 1 GHz passband. The 3.5 dB insertion loss specification should be evaluated against link budget requirements. Verify that the 50 Ohm impedance matches the surrounding RF trace network to minimize reflection losses in the application circuit.

Part Context

This component belongs to the Knowles Dielectric Labs Bandpass series, which offers various center frequencies for RF filtering needs. The B207LA0S specifically targets the Ka-band region, providing a compact solution for high-frequency signal selection. It shares design characteristics with other models in the lineup, differing primarily in resonant frequency and bandwidth specifications.

Replacement Considerations

The B207LA0S-T is a verified substitute part number representing the same electrical specifications but supplied in a tape-and-reel format instead of bulk packaging. No other cross-model replacements are confirmed in public documentation.