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The B39861B9871P810 is a Surface Acoustic Wave (SAW) filter manufactured by Qualcomm Technologies. Designed for cellular, LTE, and WCDMA applications, this component operates with an insertion loss of 1.6dB. It utilizes a 5-SMD, No Lead package configuration with a maximum height of 0.016 inches (0.40mm). The device supports surface mount installation techniques and is engineered to provide essential RF filtering for multimode wireless connectivity systems.
Verify the specific datasheet version and RoHS compliance status before integration. Confirm that the 5-SMD package dimensions align with your PCB footprint requirements. Ensure compatibility with existing RF front-end architectures. Validate moisture sensitivity levels against your assembly line capabilities. Cross-reference official documentation for any recent product change notices or lifecycle updates.
Select this component when designing for cellular, LTE, or WCDMA bands requiring low insertion loss. The small 5-SMD package suits space-constrained mobile designs. Consider its acoustic technology benefits for interference rejection. Evaluate thermal management needs relative to the specified height. Ensure system requirements match the manufacturer's electrical specifications.
This part belongs to the Qualcomm RF Front-End (RFFE) filter portfolio, which includes discrete duplexers, diplexers, and extractors. These solutions leverage ultraBAW, ultraSAW, and TC-SAW technologies. The series targets 5G/4G and Wi-Fi challenges while enabling energy-efficient multiband devices. This specific model addresses standard cellular frequency filtering needs.
It supports surface mount installation.
The maximum height is 0.016 inches (0.40mm).