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B500C1500A is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists Diotec Semiconductor. Its product description is BRIDGE RECT 1P 1KV 1.8A 4-SIP. Review the specifications below when checking this part for your BOM.
The Diotec Semiconductor B500C1500A is a single-phase diode bridge rectifier designed for commercial-grade applications. It features a repetitive peak reverse voltage (VRRM) of 1000 V and supports a maximum rectified output current of 1.8 A under free-standing conditions with a resistive load at TA = 50°C. The device operates within a junction temperature range of -50°C to +150°C, with a maximum storage temperature of the same range. Key electrical characteristics include a forward voltage (VF) of less than 1.1 V at IF = 2 A and a leakage current (IR) below 5 µA at VR = VRRM and Tj = 25°C. The typical reverse recovery time (trr) is approximately 1500 ns.
Verify the specific datasheet version before finalizing designs, as manufacturers may update specifications without notice. Confirm that the commercial grade rating aligns with the reliability requirements of the target application environment. Ensure proper thermal management strategies are implemented to maintain junction temperatures within the specified operational limits during continuous use.
Select this component when a high-voltage bridge rectifier is required for standard commercial electronics. The 1000 V rating suits high-line AC inputs. Consider the 1.8 A free-standing current limit and the need for heatsinking if operating near maximum ratings. Verify lead spacing and mounting options against the PCB layout constraints.
This part belongs to the BxxC1500x series from Diotec Semiconductor, which includes various voltage ratings ranging from 40 V to 1000 V. The B500C1500A specifically denotes the 1000 V variant within this family of single-phase bridge rectifiers. The 'A' suffix indicates a specific pinning version compared to the 'B' variant.
Check for identical electrical parameters such as 1000 V VRRM, 1.8 A IFAV, and similar package dimensions. Verify compatibility with existing thermal design constraints and mounting hardware.
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