B57238S0250M000

Inrush Current Limiters (ICL) Overview

The B57238S0250M000 is a coated NTC thermistor disk designed for inrush current limiting in line applications. It features a nominal resistance of 25 Ohms with a tolerance of ±20%. The component supports series connections up to 265 VRMS and has a rated power dissipation of 3.9 W. It utilizes kinked leads made of tinned copper wire for PCB mounting.

Inrush Current Limiters (ICL) Feature Summary

• Coated thermistor disk construction suitable for line applications
• Capable of use in series connections up to 265 VRMS
• Utilizes kinked leads of tinned copper wire

Inrush Current Limiters (ICL) Applications

• Inrush current limiting
• Line applications

Inrush Current Limiters (ICL) Procurement Notes

Verify the specific manufacturer designation, as this part number may be associated with EPCOS or TDK Electronics depending on the supply chain history. Confirm that the datasheet explicitly lists the 25 Ohm resistance and 3.9 W power rating for this exact suffix. Ensure the procurement documentation matches the required leaded package style and voltage ratings.

Inrush Current Limiters (ICL) Selection Notes

Select this component when an NTC thermistor is required for inrush current protection in AC line applications. The 25 Ohm resistance value must align with the circuit's peak current requirements. Verify that the 265 VRMS maximum series connection voltage meets the system's electrical specifications before integration.

Inrush Current Limiters (ICL) Part Context

This component belongs to the B57238 series of inrush current limiters manufactured by TDK (formerly EPCOS). These devices are specifically engineered as coated thermistor disks to protect electronic circuits from high initial charging currents during power-up phases in various line-connected equipment.

Inrush Current Limiters (ICL) Replacement Considerations

Cross-reference with other B57238 series variants having similar resistance values. Ensure any substitute maintains the 265 VRMS series connection capability and compatible physical dimensions for the existing PCB footprint.