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The B5743-208-M-T-R is a Datamate L-Tek header manufactured by Harwin Inc. It features an 8-position, 2-row configuration with a 2 mm pitch. The component utilizes through-hole mounting and solder pin termination. Contact plating is gold, ensuring reliable conductivity. The shrouded design provides alignment stability. Operating temperature ranges from -55°C to +125°C. Mating stacking heights are available at 7.23mm, 7.85mm, 10.2mm, and 13.51mm.
Verify the specific suffix 'R' against official Harwin documentation to confirm it denotes the correct reel packaging or variant designation. Ensure compatibility with corresponding female connectors in the Datamate L-Tek family. Check RoHS compliance status directly on the datasheet, as regulatory requirements may vary by production batch. Confirm that the specified stacking heights match the mechanical constraints of the target assembly.
Select this part for applications requiring robust through-hole connections with high reliability. The 2 mm pitch allows for dense board layouts. Consider the available stacking heights when designing the enclosure. Gold plating offers superior corrosion resistance compared to tin variants. Ensure the mating connector matches the male pin gender specification of this header.
This component belongs to the Harwin Datamate L-Tek family, known for high-density interconnects. The B5743 series specifically addresses needs for secure, latched connections in demanding environments. It serves as a critical interface between PCBs and external wiring or daughterboards. The design emphasizes mechanical stability and electrical performance.
The B5743-208-M-T-R supports mating stacking heights of 7.23mm, 7.85mm, 10.2mm, and 13.51mm.
Yes, the Datamate L-Tek B5743 series headers feature a shrouded design to ensure proper alignment during mating.