B82453C0285A000

Rfid Antennas Overview

The B82453C0285A000 is a transponder coil manufactured by EPCOS - TDK Electronics, belonging to the B82453C series. It features a specialized core geometry and laser-welded construction designed for high thermal stability. The component utilizes a ferrite core and high thermal class wire to ensure performance consistency across temperature variations. Measured at a frequency of 125 kHz with an RMS voltage of 100 mV at +25 °C, it exhibits a rated inductance tolerance of ±3%. The physical dimensions are 11.5 x 12.5 x 3.6 mm.

Rfid Antennas Feature Summary

• Laser-welded construction for mechanical robustness
• Ferrite core with stability in temperature
• High thermal class wire insulation

Rfid Antennas Applications

• Transponder systems
• RFID applications
• Inductive coupling interfaces

Rfid Antennas Procurement Notes

Verify the specific ordering suffix against official TDK documentation to confirm exact manufacturing specifications. Ensure compatibility with existing assembly processes regarding the tape and reel packaging format. Cross-reference the part number with current product status to confirm active availability before finalizing procurement plans.

Rfid Antennas Selection Notes

Select this component when a compact transponder coil with precise inductance tolerance is required. The laser-welded design offers reliability advantages over traditional winding methods. Consider the 125 kHz operating frequency and physical footprint constraints during the initial circuit layout phase to ensure optimal integration.

Rfid Antennas Part Context

This component belongs to the B82453C*A series of transponder coils from EPCOS (TDK). These coils are engineered for applications requiring stable inductive properties within a small form factor. The series is characterized by its use of ferrite cores and specialized winding techniques to meet stringent automotive and industrial standards.

Rfid Antennas Replacement Considerations

Consult official TDK substitution guides for direct equivalents. Verify that any substitute maintains the same inductance tolerance, frequency rating, and physical dimensions to ensure seamless integration without redesigning the host PCB.