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B82477C6103M603 is listed in the Arrays, Signal Transformers range at ChipApex. The manufacturer field lists EPCOS - TDK Electronics. Its product description is INDUCT ARRAY 2 COIL 10UH SMD. Review the specifications below when checking this part for your BOM.
The B82477C6103M603 is a surface-mount power inductor from the B82477C6 series manufactured by EPCOS (TDK). It features a wirewound construction with a ferrite core and is shielded to minimize electromagnetic interference. The component has an inductance of 10 µH with a tolerance of ±20%. It supports a rated current of 350 mA and a saturation current of 420 mA. The DC resistance is 19.1 mOhms maximum. Designed for operation between -55 °C and +150 °C, it utilizes a tape and reel packaging format.
Verify the specific ordering suffix against official TDK documentation to ensure correct packaging and tolerance specifications. Confirm that the requested part matches the exact electrical parameters required for your circuit design. Cross-reference the manufacturer's datasheet for any updates on material composition or environmental compliance declarations prior to procurement.
Select this component based on its 10 µH inductance value and 350 mA current rating requirements. Ensure the PCB layout accommodates the physical dimensions of the SMT package. Consider the low DC resistance for efficiency optimization in power supply designs. Verify thermal management capabilities given the wide operating temperature range.
This component belongs to the B82477C6 series of SMT power inductors. The series is characterized by its compact size and high current handling capabilities. It is widely used in automotive electronics due to its robust construction and reliability under harsh conditions. The manufacturer provides detailed application notes for integration into various power management topologies.
Consult official TDK documentation for confirmed substitute part numbers within the same series or family. Ensure any replacement maintains identical inductance, current ratings, and physical footprint. Verify compatibility with existing assembly processes and regulatory certifications before implementation.
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