B82721J2252N020

Overview

The B82721J2252N020 is a current-compensated ring core double choke designed for power line applications. It features a ferrite core and polycarbonate case with polyurethane potting. The component provides an inductance of 600 µH at 100 kHz and supports a maximum DC current of 2.5 A. It operates within a temperature range of -40°C to +125°C and meets UL 94 V-0 flame retardancy standards.

Feature Summary

• Current-compensated design minimizes stray inductance for symmetrical interference suppression
• High resonance frequency achieved through specialized sector winding technique
• Flame-retardant construction using UL 94 V-0 rated polycarbonate and polyurethane

Applications

• Common-mode interference suppression in compact switch-mode power supplies
• EMI filtering in general-purpose converters
• Power line chokes for electronic equipment requiring high thermal stability

Procurement Notes

Verify the specific suffix N020 against official EPCOS/TDK documentation to confirm terminal configuration and compliance status. Ensure the selected variant matches the required 600 µH inductance and 2.5 A current rating for the target circuit design before procurement.

Selection Notes

Select this component when low stray inductance is critical for effective common-mode noise reduction. The wide operating temperature range and high current capability make it suitable for demanding industrial and consumer power supply environments where space constraints require compact ring core solutions.

Part Context

This part belongs to the B82721 series of current-compensated ring core double chokes manufactured by EPCOS, now part of TDK Electronics. The series is engineered for suppressing common-mode interference in various types of switch-mode power supplies and converters, offering robust performance across diverse industrial and commercial applications.

Replacement Considerations

Consult official EPCOS/TDK substitution guides for verified alternatives. Cross-referencing requires matching inductance, current rating, and physical dimensions to ensure compatibility without modifying the existing PCB layout or thermal management strategy.