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The B82724J2512N020 is a current-compensated ring core double choke from the B82724A/J series, manufactured by EPCOS (TDK). It features an inductance of 4.1 mH at 10 kHz and supports a maximum rated current of 5.1 A. The component has a typical DC resistance of 46 mOhm and withstands 250 V AC line-to-line voltage with a 1500 V AC test voltage for 2 seconds. Designed for through-hole mounting, it operates within a temperature range of -40°C to +125°C and utilizes a horizontal package configuration.
Verify the exact datasheet version when sourcing, as TDK Electronics may update specifications or packaging details over time. Confirm that the component meets the required thermal and electrical ratings for your specific application environment. Ensure compatibility with through-hole assembly processes and verify compliance with relevant safety standards such as IEC or UL if applicable to your end product.
Select this component when high current handling capacity and robust common mode rejection are required in AC power lines. The 4.1 mH inductance provides effective filtering for standard frequency ranges. Consider the horizontal mounting style for PCB layout constraints. Ensure the 5.1 A current rating exceeds the peak operational current of the target circuit to prevent saturation and maintain performance stability under load conditions.
This part belongs to the B82724A/J series of power line chokes designed for current-compensated applications. These components are engineered for use in environments requiring reliable EMI suppression and high current tolerance. The series is widely used in industrial and commercial power systems where stable operation under varying load conditions is critical for system integrity and compliance with electromagnetic interference regulations.
Check TDK's official substitution guide for equivalent parts within the B82724 series or other current-compensated chokes with matching inductance and current ratings. Verify pin compatibility and mechanical dimensions before replacing to ensure seamless integration into existing designs without modifying the PCB footprint.