BAL-UWB-01E3

Balun Overview

The BAL-UWB-01E3 is an ultra-miniature balun designed for ultra-wide band applications ranging from 3 GHz to 8 GHz. It converts between 50 ohm unbalanced and 100 ohm balanced impedances, integrating a matching network on a non-conductive glass substrate using IPD technology. The device features a 6-pin SMD no-lead package with dimensions of 1.825 mm length and a thickness of ≤ 450 µm. Key electrical parameters include a maximum insertion loss of 1.2 dB and a minimum return loss of 12 dB. It operates within a temperature range of -40°C to 105°C.

Balun Feature Summary

• Integrates matching network for ultra-wide band 3 GHz to 8 GHz operation
• Utilizes STMicroelectronics IPD technology on non-conductive glass substrate
• Ultra-miniature low profile design compatible with LGA footprints
• Optimized RF performance with very low thickness

Balun Applications

• Ultra-wide band (UWB) communication systems
• RF signal conditioning circuits
• Balanced-to-unbalanced impedance conversion in high-frequency electronics

Balun Procurement Notes

Verify the specific ordering suffix and packaging configuration required for your production line, as the component is available in tape and reel formats. Confirm that the 6-SMD no-lead package dimensions align with your PCB footprint constraints. Ensure that the operating temperature range of -40°C to 105°C meets your environmental specifications. Check for RoHS3 compliance status if required by your regulatory framework. Validate the lead time estimates provided by authorized distributors against your project schedule.

Balun Selection Notes

Select this component when designing for UWB frequencies between 3 GHz and 8 GHz requiring a 50 ohm to 100 ohm transformation. The integrated matching network reduces external component count and PCB space. Consider the IPD technology on glass substrate for superior RF performance compared to traditional substrates. The low profile and LGA compatibility make it suitable for space-constrained mobile and portable devices. Ensure the thermal management capabilities support the specified operating temperature range.

Balun Part Context

This part belongs to the BAL-UWB series from STMicroelectronics, focusing on ultra-wide band solutions. It leverages proprietary IPD technology to achieve high performance in a miniature form factor. The series targets modern wireless applications demanding efficient signal integrity and compact layouts. The use of a non-conductive glass substrate distinguishes it from standard ceramic or organic alternatives, offering specific RF advantages.

Balun Replacement Considerations

No public confirmed substitute part numbers are identified in the provided documentation. Direct replacement requires verifying pinout compatibility, impedance values, frequency range, and package dimensions. Consult STMicroelectronics for potential obsolescence notices or recommended upgrades.