BALF-2690-02D3

BALF-2690-02D3

  • Description:BALUN 2.4GHZ-2.5GHZ 4UFBGA FCBGA
  • Series:-
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:14e89bf70166 Category: Brand:

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Product Detailed Parameters

  • Description:BALUN 2.4GHZ-2.5GHZ 4UFBGA FCBGA
  • Series:-
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:2.4GHz ~ 2.5GHz
  • Impedance - Unbalanced/Balanced:50 / -Ohm
  • Phase Difference:10°
  • Insertion Loss (Max):1.2dB
  • Return Loss (Min):15dB
  • Package / Case:4-UFBGA, FCBGA
  • Mounting Type:Surface Mount

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BALF-2690-02D3

Overview

The BALF-2690-02D3 is a balun designed by STMicroelectronics to transform single-ended signals into differential signals for Bluetooth applications. It features a 50 ohm nominal input and provides a conjugate match. The device operates with a maximum frequency of 2.5 GHz and a minimum frequency of 2400 MHz. It has an insertion loss of 1.2 dB and supports surface mount installation. The component functions within a temperature range of -40°C to 105°C and utilizes a CSPG package.

Feature Summary

  • Transforms single-ended signals to differential signals for Bluetooth applications
  • Integrates matching network and harmonic filtering capabilities
  • Optimized for high RF performance in compact designs

Applications

  • Bluetooth wireless communication modules
  • Single-ended to differential signal conversion circuits
  • RF front-end integration for sub-GHz and 2.4 GHz transceivers

Procurement Notes

Verify current availability status as the manufacturer may schedule this component for obsolescence. Confirm that the specific package type and pin configuration match your PCB layout requirements. Ensure that the operating temperature range aligns with your environmental specifications. Check for updated datasheets to confirm any changes in electrical characteristics or recommended design-in guidelines before finalizing procurement plans.

Selection Notes

Select this component when designing Bluetooth systems requiring a dedicated balun with integrated matching. Consider its small form factor and low insertion loss for space-constrained applications. Verify compatibility with the target transceiver's impedance requirements. Evaluate thermal performance against the specified operating temperature limits. Compare alternative baluns if higher frequency ranges or different package styles are required.

Part Context

This balun belongs to STMicroelectronics' portfolio of RF components tailored for wireless connectivity. It complements other baluns like the BALFHB-WL-02D3, which targets STM32WL microcontrollers. The device addresses the need for efficient signal conversion in compact wireless modules, supporting the broader ecosystem of Bluetooth-enabled IoT devices and consumer electronics.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Users should consult official STMicroelectronics resources for potential alternatives or contact distributors for stock availability updates.

BALF-2690-02D3BALF-2690-02D3

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