BALF-NRF01D3

Overview

The BALF-NRF01D3 is an ultraminiature balun from STMicroelectronics designed for RF applications. It features a 50 Ω nominal input and provides a conjugate match to specific Nordic Semiconductor circuits, including the nRF24LE1, nRF24AP2-1CH, nRF24AP2-8CH, nRF51422-QFAA, nRF51822-QFAA, and nRF51822-QFAB. The device integrates a matching network within a monolithic glass substrate using IPD technology. Key performance characteristics include low insertion loss, low amplitude imbalance, and low phase imbalance. The component occupies a small footprint of less than 1.5 mm².

Feature Summary

• Integrates matching network in a monolithic glass substrate
• Optimizes RF performance using Integrated Passive Device technology
• Provides conjugate match to designated Nordic Semiconductor chips

Applications

• Integration with nRF24LE1 QFN-32 pins
• Integration with nRF24AP2-1CH and nRF24AP2-8CH
• Integration with nRF51422-QFAA and nRF51822 series chips
• Use in nRF2723 and nRF2752 nRFgo modules

Procurement Notes

Verify that the specific Nordic Semiconductor chip build code matches the design requirements, as impedance customization is specific to certain revisions such as CA/C0 or AA/A0. Confirm that the application utilizes the integrated matching network capabilities of the BALF-NRF01D3 rather than requiring external components. Ensure the PCB layout accommodates the ultraminiature footprint size for proper signal integrity.

Selection Notes

Select this component when designing systems with compatible Nordic Semiconductor transceivers requiring a compact solution. The choice is driven by the need for integrated matching and filtering in a minimal space. Consider the IPD technology benefits for RF optimization. This part is suitable for space-constrained designs where low insertion loss and balanced signal transmission are critical for system performance.

Part Context

This balun belongs to a family of ultraminiature components utilizing STMicroelectronics' IPD technology on non-conductive glass substrates. It is distinct from other baluns by its specific integration of matching networks for Nordic Semiconductor devices. The product line emphasizes optimized RF performance and small form factors for modern wireless applications.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Designers should verify compatibility with existing Nordic Semiconductor circuit revisions before considering alternative components.