Balun BALF-NRF01E3 product image

BALF-NRF01E3

$0.27
  • Description:BALUN 2.4GHZ-2.54GHZ 6XFLGA
  • Series:-
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:033d3eb58444 Category: Brand:

  
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BALF-NRF01E3 is listed in the Balun range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is BALUN 2.4GHZ-2.54GHZ 6XFLGA. Review the specifications below when checking this part for your BOM.

Balun specifications for BALF-NRF01E3

  • Description:BALUN 2.4GHZ-2.54GHZ 6XFLGA
  • Series:-
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:2.4GHz ~ 2.54GHz
  • Impedance - Unbalanced/Balanced:50 / -Ohm
  • Phase Difference:4°
  • Insertion Loss (Max):2.2dB
  • Return Loss (Min):15dB
  • Package / Case:6-XFLGA
  • Mounting Type:Surface Mount

Balun datasheet and documents for BALF-NRF01E3

BALF-NRF01E3

Balun Overview

The STMicroelectronics BALF-NRF01E3 is an ultraminiature balun designed for RF applications. It operates within a frequency range of 2.4 GHz to 2.54 GHz, with a maximum operational limit up to 8 GHz. The component features a nominal input impedance of 50 Ω and a balanced impedance of 100 Ω. It exhibits a maximum insertion loss of 1.2 dB. Physically, it utilizes a 6-pin XFLGA package with dimensions of 1.825 mm in length and 0.48 mm in height. The device supports surface mount installation and functions reliably between -40 °C and +105 °C.

Balun Feature Summary

  • Integrates matching network on a monolithic glass substrate
  • Ultraminiature form factor suitable for space-constrained designs
  • Flip chip bumbleless CSPG packaging technology

Balun Applications

  • Bluetooth Low Energy (BLE) modules
  • Zigbee wireless sensor networks
  • Wi-Fi connectivity solutions

Balun Procurement Notes

Verify the specific ordering suffix to ensure compatibility with required tape and reel configurations. Confirm that the selected variant matches the intended PCB footprint and thermal requirements. Cross-reference the manufacturer's latest datasheet for any updates to mechanical drawings or electrical specifications prior to finalizing procurement orders.

Balun Selection Notes

Select this component when a compact solution is required for 2.4 GHz ISM band applications. The integrated matching network reduces external component count. Ensure the design accommodates the specific thermal dissipation characteristics of the glass substrate. Verify that the operating temperature range meets the environmental constraints of the target application.

Balun Part Context

This part belongs to the BALF series of baluns from STMicroelectronics. These components are engineered for high-frequency signal conditioning. The series focuses on miniaturization and integration to support modern wireless communication standards. The BALF-NRF01E3 specifically targets ultra-low power and small form factor requirements.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official distributor databases for cross-reference data.

BALF-NRF01E3BALF-NRF01E3
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