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Product Detailed Parameters
- Description：INTEGRATED FILTER MATCHED BALUN
- Series：-
- Mfr：STMicroelectronics
- Package：Tape & Reel (TR),Cut Tape (CT)
- Frequency Range：862MHz ~ 928MHz
- Impedance - Unbalanced/Balanced：-
- Phase Difference：0°
- Insertion Loss (Max)：1.4dB
- Return Loss (Min)：15dB
- Package / Case：8-WFBGA, CSPBGA
- Mounting Type：Surface Mount
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Overview
The BALFHB-WL-05D3 is an ultra-miniature integrated passive device (IPD) balun designed for sub-GHz wireless applications. It operates within the 862 MHz to 928 MHz frequency range and features a 50-ohm impedance. The component integrates a matching network, balun, and harmonics filter into a single package. It utilizes STMicroelectronics IPD technology and is specifically customized for STM32WL low-power microcontrollers. The device is available in an 8-WFBGA CSPBGA package with SMD/SMT termination.
Feature Summary
- Integrates matching network, balun, and harmonics filter
- Customized for STM32WL sub-GHz wireless microcontrollers
- Utilizes integrated passive device (IPD) technology
Applications
- Sub-GHz wireless communication systems
- IoT devices using STM32WL microcontrollers
- Low-power RF front-end modules
Procurement Notes
Verify the specific ordering suffix and package variant when sourcing. Confirm that the component matches the required 862-928 MHz operational band for your design. Ensure compatibility with the target STM32WL series microcontroller. Check datasheet specifications for insertion loss and return loss requirements. Validate package dimensions against PCB layout constraints before finalizing procurement.
Selection Notes
Select this component when designing for sub-GHz ISM bands requiring high integration. It is ideal for space-constrained IoT applications utilizing STM32WL processors. The integrated filter reduces external component count. Consider the 1.2 dB insertion loss specification for link budget calculations. Ensure the design supports the 8-WFBGA package footprint.
Part Context
This balun belongs to the BALFHB/LB-WL-0xD3 family of companion chips developed by STMicroelectronics. These components are part of a broader ecosystem supporting low-power wireless connectivity. They serve as optimized RF front-end solutions for microcontrollers lacking integrated sub-GHz transceivers. The family focuses on simplifying board design through integration.
Replacement Considerations
Consult Application Note AN6322 for guidelines on selecting alternative IPD baluns from the same family. Verify electrical performance equivalence for the specific frequency band. Ensure package compatibility if substituting with other variants in the BALFHB/WL series.
