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BALFLB-WL-09D3 is listed in the Balun range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is BALUN,FILTERING AND MATCHING OF. Review the specifications below when checking this part for your BOM.
The BALFLB-WL-09D3 is an ultra-miniature balun from STMicroelectronics designed for STM32WL sub-GHz wireless microcontrollers. It integrates a matching network, balun, and harmonics filter within a QFN package suitable for two-layer PCBs. The device operates in the 470 MHz to 510 MHz frequency range with a nominal input impedance of 50 ohms. It features a low insertion loss of 1.9 dB and provides deep Tx rejection harmonic filtering. Optimized for high power mode operation at 17 dBm, this component utilizes IPD technology on a nonconductive glass substrate to ensure high RF performance and minimal footprint.
Verify that the specific suffix D3 corresponds to the QFN-2L package variant intended for two-layer PCB applications. Confirm compatibility with the STM32WL microcontroller's high power mode requirements. Ensure the ordering documentation explicitly references the 470 MHz to 510 MHz operational range. Cross-reference the part number against official STMicroelectronics datasheets to validate the integrated harmonic filter specifications. Check for any specific handling instructions related to the ultra-miniature form factor during assembly.
Select this component when designing for STM32WL sub-GHz applications requiring a compact solution. It is appropriate for systems needing integrated balancing and filtering without external discrete components. Consider its suitability for two-layer PCB layouts due to its specific impedance matching customization. Evaluate its performance in high power modes where deep Tx rejection is critical. Ensure the physical dimensions align with the strict space constraints of the target module design.
This balun belongs to STMicroelectronics' family of ultra-miniature RF components tailored for the STM32WL series. Unlike general-purpose baluns, it is uniquely engineered with customized impedance matching for these specific microcontrollers. The product line emphasizes area reduction and BOM simplification by combining multiple RF functions into a single small footprint package.
Public confirmed substitute part numbers are not available in the provided documentation.
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