BAS516-QF

Single Diodes Overview

The BAS516-QF is a high-speed switching diode from Nexperia, encapsulated in an SOD523 (SC-79) ultra-small surface-mounted package. It features a maximum reverse voltage of 100 V and a repetitive peak reverse voltage of 100 V. The device exhibits a low reverse recovery time of 4 ns and minimal capacitance. Qualified according to AEC-Q101, it supports automotive applications with a junction temperature range up to 150 °C and total power dissipation of 500 mW.

Single Diodes Feature Summary

• High switching speed with a reverse recovery time of 4 ns
• Qualified for automotive applications per AEC-Q101 standards
• Low leakage current and low capacitance characteristics
• Ultra-small SMD plastic package design

Single Diodes Applications

• High-speed switching circuits
• General-purpose switching applications

Single Diodes Procurement Notes

Verify the specific ordering suffix matches the required packaging configuration before procurement. Confirm that the component meets the necessary AEC-Q101 qualification requirements for your target application environment. Ensure compatibility with standard reflow soldering profiles for the SC-79 package type.

Single Diodes Selection Notes

Select this component when designing circuits requiring fast switching speeds within a compact footprint. Consider its 100 V reverse voltage rating for appropriate circuit protection levels. Evaluate the thermal resistance characteristics if operating near maximum power dissipation limits in confined spaces.

Single Diodes Part Context

This part belongs to Nexperia's BAS516 series of high-speed switching diodes. It shares core electrical specifications with the standard BAS516 but includes additional automotive qualification under AEC-Q101. The QF suffix typically denotes specific tape-and-reel packaging variations within the manufacturer's distribution channels.

Single Diodes Replacement Considerations

Direct substitutes include the standard BAS516 for non-automotive contexts. Verify pinout compatibility and package dimensions against existing board layouts when considering alternative manufacturers' equivalents.