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BAT5402VH6327XTSA1 is listed in the Single Diodes range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DIODE SCHOTTKY 30V 200MA PGSC792. Review the specifications below when checking this part for your BOM.
The BAT5402VH6327XTSA1 is a Schottky barrier diode manufactured by Infineon Technologies, designed for surface-mount applications in the PG-SC79-2 package. It features a maximum DC reverse voltage of 30 V and an average rectified current of 200 mA. Key electrical parameters include a forward voltage of 800 mV at 100 mA, a reverse leakage current of 2 µA at 25 V, and a junction capacitance of 10 pF at 1 V and 1 MHz. The device supports a maximum junction temperature of 150°C and holds AEC-Q101 qualification.
Verify component authenticity through authorized distribution channels to ensure compliance with automotive quality standards. Confirm that the specific suffix matches the required package and tape-and-reel specifications for your manufacturing equipment. Cross-reference the manufacturer datasheet for updated environmental declarations and handling instructions prior to integration into production workflows.
Select this component when a low-capacitance Schottky diode is required for small-signal applications under 30 V. The 200 mA current rating suits moderate load conditions where minimal voltage loss is critical. Ensure the operating environment remains within the specified thermal limits to maintain performance stability over the intended service life.
This part belongs to the BAT54 series of dual Schottky diodes from Infineon Technologies. The series is widely utilized in consumer and automotive electronics for its balance of speed and efficiency. The VH6327 suffix indicates specific packaging and ordering details consistent with Infineon's standard product nomenclature for surface-mount devices.
Consult official replacement guides for equivalent Schottky diodes with matching voltage and current ratings. Verify pin compatibility and thermal characteristics before substituting to ensure circuit integrity without redesigning the footprint or cooling requirements.
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