BAT760,115

Single Diodes Overview

The Nexperia BAT760,115 is a medium power Schottky barrier single diode featuring an integrated guard ring for stress protection. Encapsulated in the SOD323 (SC-76) surface-mounted device plastic package, it supports a reverse voltage of 20 V and a forward current of 1 A. The component exhibits a typical forward voltage of 480 mV at 1 A and a maximum non-repetitive peak forward current of 5 A. It operates within a junction temperature range of -65 °C to 125 °C.

Single Diodes Feature Summary

• Ultra high-speed switching capability
• Very low forward voltage drop
• Guard-ring protected structure

Single Diodes Applications

• Ultra high-speed switching
• Voltage clamping
• Protection circuits

Single Diodes Procurement Notes

Verify the specific ordering suffix matches the required packaging configuration before procurement. Confirm that the application environment remains within the specified thermal limits and does not exceed the absolute maximum ratings defined in the datasheet. Ensure compliance with RoHS directives as indicated in the product documentation.

Single Diodes Selection Notes

Select this component for designs requiring compact surface-mount solutions with fast recovery characteristics. The SOD323 package is suitable for space-constrained PCB layouts. Evaluate the thermal resistance requirements against the intended mounting pad size on the FR4 printed-circuit board to ensure adequate heat dissipation during operation.

Single Diodes Part Context

This part belongs to the Nexperia Schottky barrier diode portfolio, designed for general-purpose rectification and signal processing. The BAT760 variant specifically targets applications needing robust performance in a minimal footprint. It serves as a standard discrete semiconductor solution for modern electronic assemblies.

Single Diodes Replacement Considerations

Check for direct cross-reference equivalents from other manufacturers offering identical pinouts and electrical specifications. Verify that any substitute maintains the same SOD323 package dimensions and thermal characteristics to ensure compatibility with existing footprints.