BAV70-HF

BAV70-HF

$0.12
  • Description:DIODE ARRAY GP 70V 200MA SOT23-3
  • Series:-

SKU:0fcf177dac86 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:DIODE ARRAY GP 70V 200MA SOT23-3
  • Series:-
  • Mfr:Comchip Technology
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):70 V
  • Current - Average Rectified (Io) (per Diode):200mA (DC)
  • Voltage - Forward (Vf) (Max) @ If:1.25 V @ 150 mA
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):6 ns
  • Current - Reverse Leakage @ Vr:2.5 µA @ 70 V
  • Operating Temperature - Junction:150°C (Max)
  • Mounting Type:Surface Mount
  • Package / Case:TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package:SOT-23-3
  • Grade:-
  • Qualification:-

Download product information

BAV70-HF

Overview

The BAV70-HF is a dual small-signal switching diode manufactured by Comchip Technology. It features a common cathode configuration with two silicon epitaxial planar diodes integrated into a single compact package. Designed for high-speed applications, the device utilizes majority carrier conduction to achieve low forward voltage and fast switching times. The component is housed in an extremely thin leadless surface-mount package, optimizing board space while maintaining reliable electrical performance for signal processing tasks.

Feature Summary

  • Dual diode structure with common cathode configuration
  • Fast switching capability utilizing majority carrier conduction
  • Low forward voltage characteristics
  • Extremely thin leadless surface-mount package design

Applications

  • High-speed signal switching circuits
  • Clamping and protection applications
  • Logic level shifting interfaces
  • RF signal demodulation

Procurement Notes

Verify the specific suffix designation against official Comchip Technology documentation to confirm exact pinout and thermal specifications. Ensure that the selected variant matches the required operating temperature range and reverse voltage ratings for the target application environment before finalizing procurement orders.

Selection Notes

Select this component when space-constrained designs require dual switching functions within a minimal footprint. The leadless package architecture supports automated surface-mount assembly processes. Evaluate the trade-off between the low forward voltage benefits and the specific switching speed requirements of the circuit topology during the design phase.

Part Context

This component belongs to the family of small-signal switching diodes designed for general-purpose electronic applications. It serves as a compact alternative to discrete dual-diode arrangements, offering improved reliability through integrated packaging. The technology leverages silicon epitaxial planar processes to ensure consistent performance across manufacturing batches.

Replacement Considerations

Cross-reference with other AEC-Q101 qualified dual diodes if automotive qualification is mandatory. Verify pin compatibility with existing footprints when substituting similar leadless packages from different manufacturers.

BAV70-HFBAV70-HF
$0.12
Buy Now