BBBK00160808252Y00

Overview

The BBBK00160808252Y00 is a shielded multilayer ferrite chip bead manufactured by Pulse Electronics. It features a 0603 (1608 metric) surface-mount package with dimensions of 1.6 mm length, 0.8 mm width, and 0.8 mm height. The component provides an impedance of 2.5 kOhms at a test frequency of 100 MHz with a tolerance of 25%. It supports a maximum DC current of 200 mA and has a maximum DC resistance of 800 mOhms. The device operates within a temperature range of -55°C to +125°C.

Feature Summary

• Shielded construction minimizes electromagnetic interference coupling
• Multilayer ferrite chip design for compact integration
• High impedance performance at 100 MHz for noise suppression

Applications

• Signal line filtering in electronic circuits
• Power supply noise attenuation
• EMI suppression in portable devices

Procurement Notes

Verify the manufacturer part number BBBK00160808252Y00 against official Pulse Electronics documentation to confirm specifications. Ensure compatibility with 0603 footprint requirements and thermal limits. Check RoHS compliance status via the datasheet. Confirm availability through authorized distributors as stock levels vary.

Selection Notes

Select this component when high impedance at 100 MHz is required for signal integrity. The 200 mA current rating suits low-power applications. The shielded design is critical for sensitive environments. Verify that the 800 mOhm DCR meets voltage drop constraints. Ensure the operating temperature range fits the application environment.

Part Context

This ferrite bead belongs to Pulse Electronics' passive components portfolio, specifically designed for EMI suppression. It complements other shielded beads in the series offering various impedance and current ratings. The 0603 form factor allows for dense PCB layouts. It serves as a key element in maintaining signal purity in modern electronics.

Replacement Considerations

Check for direct substitutes with identical 2.5 kOhms impedance and 200 mA rating. Verify package dimensions and shielding characteristics match. Ensure thermal and electrical parameters align with original design requirements before substitution.