BBBK00201209252Y00

Overview

The BBBK00201209252Y00 is a multilayer ferrite chip bead from the Pulse Electronics BBBK series, designed for signal line noise suppression. It features an 0805 (2012 metric) surface-mount package with dimensions of 2.0 mm length, 1.25 mm width, and 0.9 mm height. The component provides an impedance of 2.5 kOhms at 100 MHz and supports a maximum DC current rating of 200 mA. Its maximum DC resistance is specified as 700 mOhms.

Feature Summary

• Multilayer ferrite construction for effective high-frequency noise attenuation
• Compact 0805 surface-mount footprint suitable for space-constrained designs
• Single signal line configuration for targeted EMI suppression

Applications

• Signal line noise filtering in electronic circuits
• EMI suppression in portable devices
• High-frequency interference reduction in communication modules

Procurement Notes

Verify the complete part number including suffixes to ensure correct impedance and tolerance specifications. Confirm package dimensions and termination style match design requirements. Check manufacturer datasheets for detailed electrical characteristics and reliability data before integration into final products.

Selection Notes

Select this component when specific high-frequency noise suppression is required on signal lines within limited board space. Consider the 200 mA current rating and 700 mOhm DC resistance against circuit load requirements. Ensure compatibility with standard reflow soldering processes for the 0805 package type.

Part Context

This ferrite bead belongs to the Pulse Electronics BBBK series, which offers various impedance values and current ratings in standard SMD packages. These components are engineered for broadband noise absorption rather than resonant filtering, making them distinct from inductors or capacitors in passive filter networks.

Replacement Considerations

Consult official substitution guides for equivalent parts with matching impedance curves and current ratings. Verify that alternative components meet the same physical dimension constraints and thermal performance standards.