BBNQ00100505471Y00

Overview

The BBNQ00100505471Y00 is a shielded multilayer ferrite chip bead manufactured by Pulse Electronics. It features an impedance of 470 ohms with a 25% tolerance, measured at a test frequency of 100 MHz. The component supports a maximum DC current of 300 mA and has a maximum DC resistance (DCR) of 500 milliohms. It operates within a temperature range of -55°C to +125°C. The device utilizes a 0402 (1005 metric) surface-mount package with dimensions of 1 mm length, 0.5 mm width, and 0.5 mm height.

Feature Summary

• Shielded construction to minimize electromagnetic interference
• Multilayer ferrite chip design for compact integration
• Surface-mount termination for automated assembly

Applications

• High-frequency noise suppression in portable electronics
• Signal integrity protection in mobile communication devices
• Power line filtering in consumer hardware

Procurement Notes

Verify the specific impedance value and current rating against the official datasheet before procurement. Confirm that the 0402 package dimensions align with the target PCB footprint. Ensure the operating temperature range meets the environmental requirements of the final application. Check for RoHS compliance status if required by regulatory standards.

Selection Notes

Select this component when a 470-ohm impedance at 100 MHz is required for noise attenuation. The 300 mA current rating suits low-power signal lines. The shielded design is preferred over unshielded variants to prevent magnetic field coupling. The 0402 size offers space efficiency for dense circuit boards.

Part Context

This part belongs to the BBNQ series of ferrite beads from Pulse Electronics. It is designed as a multilayer chip bead for surface-mount technology. The series focuses on providing effective high-frequency noise suppression in compact form factors suitable for modern electronic assemblies.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with alternative components based on identical impedance, current rating, and package dimensions.