BBNQ00100505750Y00

Overview

The BBNQ00100505750Y00 is a multilayer ferrite chip bead manufactured by Pulse Electronics, designed for high-speed signal lines under 1GHz. It features a shielded construction in a 0402 (1005 metric) SMD/SMT package with dimensions of 1 mm length, 0.5 mm width, and 0.5 mm height. The component exhibits an impedance of 75 Ohms at a test frequency of 100 MHz, with a tolerance of 25%. It supports a maximum DC current of 400 mA and has a maximum DC resistance of 300 mOhms. The device operates within a temperature range of -55°C to +125°C and contains two elements.

Feature Summary

• Shielded multilayer ferrite chip bead design
• Optimized for high-speed signal lines under 1GHz
• Compact 0402 surface-mount form factor

Applications

• High-speed digital signal line filtering
• EMI suppression in compact electronic devices
• Power integrity management in low-current circuits

Procurement Notes

Verify the manufacturer part number BBNQ00100505750Y00 against official Pulse Electronics documentation to ensure authenticity. Confirm that the received components match the specified 0402 package dimensions and electrical characteristics, including 75 Ohms impedance at 100 MHz. Check for physical damage to the shielded casing and validate RoHS compliance status through provided certificates or datasheet references before integration into production.

Selection Notes

Select this component when shielding is required for EMI reduction in space-constrained designs. The 400 mA current rating suits low-power signal paths rather than power delivery lines. Ensure the operating environment stays within the -55°C to +125°C range. The 75 Ohm impedance value targets specific noise frequencies around 100 MHz, making it suitable for data lines where minimal insertion loss is critical below the target frequency.

Part Context

This ferrite bead belongs to the BBNQ series from Pulse Electronics, which focuses on multilayer chip beads for noise suppression. The series utilizes shielded technology to contain magnetic fields, reducing crosstalk in dense PCB layouts. The 0402 footprint allows for high-density assembly, aligning with modern miniaturization trends in consumer electronics and telecommunications equipment requiring reliable signal integrity.

Replacement Considerations

No public confirmed substitute part numbers are available in the source material.