BBUP00201209220Y00

Overview

The BBUP00201209220Y00 is a shielded multilayer ferrite chip bead from the BBUP series, manufactured by Pulse Electronics. Designed for ultra-high current applications under 1 GHz, it features an SMD/SMT termination style in an 0805 (2012 metric) package with dimensions of 2 mm length, 1.25 mm width, and 1.5 mm height. The component provides an impedance of 22 Ohms at a test frequency of 100 MHz with a tolerance of ±25%. It supports a maximum DC current of 6 A and has a maximum DC resistance of 12 mOhms. The operating temperature range spans from -55°C to +125°C.

Feature Summary

• Shielded multilayer construction minimizes electromagnetic interference
• Optimized for ultra-high current handling capabilities
• Effective noise suppression performance below 1 GHz

Applications

• Ultra-high current circuit protection under 1 GHz
• High-density surface mount power supply filtering
• Signal integrity management in compact electronic assemblies

Procurement Notes

Verify the specific manufacturer designation, as this part number appears associated with both Pulse Electronics and YAGEO/Pulse Electronics collaborations. Confirm RoHS compliance status and exact packaging quantities directly with authorized distributors or the manufacturer before ordering. Ensure the intended application aligns with the specified 6 A current rating and 22 Ohm impedance characteristics to prevent performance deviations.

Selection Notes

Select this component when high current capacity is required alongside effective high-frequency noise attenuation in space-constrained designs. The 0805 footprint offers a balance between current handling and board area efficiency. Consider the low DC resistance to minimize voltage drop and power loss in high-current paths. Verify thermal management requirements given the 6 A rating and operating temperature limits.

Part Context

This component belongs to the BBUP series of shielded ferrite beads designed for demanding power electronics applications. The series emphasizes high current handling and low DC resistance while maintaining effective EMI suppression. The BBUP line utilizes multilayer technology to achieve compact form factors suitable for modern surface mount assembly processes.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Consult official distributor databases or manufacturer cross-reference tools for compatible alternatives that match the 0805 footprint, 6 A current rating, and 22 Ohm impedance specifications.