BBUP00201209300Y00

Overview

The BBUP00201209300Y00 is a shielded multilayer ferrite chip bead from the Pulse Electronics BBUP series, designed for surface mount applications. It features an 0805 [2012 Metric] package with dimensions of 2 mm length, 1.2 mm width, and 0.9 mm height. The component provides an impedance of 30 Ohms at a test frequency of 100 MHz with a tolerance of ±25%. It supports a maximum DC current rating of 6 A and has a maximum DC resistance of 0.012 Ω. The device operates within a temperature range of -55 °C to +125 °C and meets AEC-Q200 screening standards.

Feature Summary

• Integrated shielding structure minimizes electromagnetic interference coupling to adjacent circuitry
• Multilayer construction enables high current handling capability in a compact footprint
• AEC-Q200 qualification ensures reliability for automotive electronic environments

Applications

• Automotive power line filtering
• High-current digital signal suppression
• EMI mitigation in compact PCB layouts

Procurement Notes

Verify the specific ordering suffix against manufacturer documentation to confirm exact electrical tolerances and packaging configurations. Ensure compatibility with automated pick-and-place equipment regarding the 0805 package dimensions. Confirm RoHS compliance status through official datasheets prior to integration into regulated assemblies.

Selection Notes

Select this component when a 30 Ohm impedance at 100 MHz is required alongside a 6 A current capacity. The low DC resistance of 0.012 Ω reduces power loss in high-current paths. The shielded design is critical for dense layouts where crosstalk must be prevented. Verify that the operating temperature range of -55 °C to +125 °C meets environmental requirements.

Part Context

This part belongs to the BBUP series of shielded ferrite beads from Pulse Electronics. The series offers impedance values ranging from 10Ω to 2200Ω with a consistent 6A maximum DC current rating across variants. These components are engineered for EMI suppression in space-constrained surface mount applications requiring robust current handling.

Replacement Considerations

Cross-reference with other BBUP series variants for different impedance values if system requirements change. Verify pinout and dimensional compatibility before substituting with non-shielded or unqualified alternatives.