BBUP00453215121Y00

Overview

The BBUP00453215121Y00 is a multilayer ferrite chip bead manufactured by Pulse Electronics. It features a shielded SMD/SMT construction in an 1812 (4532 metric) package with dimensions of 4.5 mm length, 3.2 mm width, and 1.5 mm height. The component provides an impedance of 120 Ohms at a test frequency of 100 MHz with a tolerance of 25%. It supports a maximum DC current of 6 A and has a maximum DC resistance of 20 mOhms. The operating temperature range spans from -55 C to +125 C.

Feature Summary

• Shielded design for electromagnetic interference suppression
• Multilayer ferrite chip bead technology
• High current handling capability up to 6 A
• Wide operational temperature range suitable for harsh environments

Applications

• General purpose EMI filtering in electronic circuits
• Power line noise suppression
• Signal integrity enhancement in high-speed digital systems

Procurement Notes

Verify the specific ordering suffix and packaging configuration before procurement. Confirm that the required quantity aligns with the manufacturer's standard reel packaging multiples. Ensure compatibility with surface mount assembly processes. Check for any recent updates to the datasheet regarding mechanical or electrical specifications. Validate RoHS compliance status if required by your manufacturing standards.

Selection Notes

Select this component when high current capacity and low DC resistance are critical for power line applications. The shielded construction minimizes magnetic field leakage compared to unshielded alternatives. Consider the 1812 footprint availability in your PCB layout constraints. Evaluate the 120 Ohm impedance profile against the target noise frequencies to ensure effective attenuation. Compare thermal performance requirements against the specified -55 C to +125 C operating range.

Part Context

This part belongs to the BBUP series of ferrite beads from Pulse Electronics. It is categorized under Ferrites within the broader passive components family. The product is designed for surface mount technology integration. It serves as a key element for noise suppression in modern electronic assemblies requiring robust EMI control.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.