Balun BCM 3225F3SF-75034-1R5-CT1-P product image

BCM 3225F3SF-75034-1R5-CT1-P

$1.33
  • Description:RF BALUN 1MHZ ~ 100MHZ 3:4 1210
  • Series:-
  • Mfr:TAI-TECH Advanced Electronics Co., Ltd.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:dd7a007355b9 Category: Brand:

  
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BCM 3225F3SF-75034-1R5-CT1-P is listed in the Balun range at ChipApex. The manufacturer field lists TAI-TECH Advanced Electronics Co., Ltd.. Its product description is RF BALUN 1MHZ ~ 100MHZ 3:4 1210. Review the specifications below when checking this part for your BOM.

Balun specifications for BCM 3225F3SF-75034-1R5-CT1-P

  • Description:RF BALUN 1MHZ ~ 100MHZ 3:4 1210
  • Series:-
  • Mfr:TAI-TECH Advanced Electronics Co., Ltd.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:1MHz ~ 100MHz
  • Impedance - Unbalanced/Balanced:-
  • Phase Difference:180° ±10
  • Insertion Loss (Max):2.0dB
  • Return Loss (Min):5dB
  • Package / Case:1210 (3225 Metric), 6 PC Pad
  • Mounting Type:Surface Mount

Balun datasheet and documents for BCM 3225F3SF-75034-1R5-CT1-P

BCM 3225F3SF-75034-1R5-CT1-P

Balun Overview

The BCM3225F3SF-75034-1R5-CT1-P is an RF balun manufactured by TAI-TECH Advanced Electronics Co., Ltd. It operates within a frequency range of 1 MHz to 100 MHz and provides a 3:4 impedance transformation ratio. The component utilizes a 1210 (3225 Metric) surface-mount package with six printed circuit board pads. This design facilitates unbalanced to balanced signal conversion for radio frequency applications while maintaining a small form factor and low profile.

Balun Feature Summary

  • Provides unbalanced to balanced signal conversion for RF circuits
  • Features a compact 1210 surface-mount package with six PCB pads
  • Supports impedance transformation ratios suitable for specific RF matching requirements

Balun Applications

  • RF signal path balancing in communication modules
  • Impedance matching networks operating between 1 MHz and 100 MHz
  • Unbalanced to balanced signal conversion in low-profile electronic devices

Balun Procurement Notes

Verify the complete part number including suffixes such as -CT1-P against official TAI-TECH documentation to ensure correct packaging and tape-and-reel specifications. Confirm that the 1210 footprint matches the target PCB layout. Cross-reference the 3:4 ratio and 1-100 MHz range with system requirements before procurement to avoid functional mismatches.

Balun Selection Notes

Select this component when a 1210 footprint is required for RF balancing tasks within the 1 MHz to 100 MHz band. Ensure the design accommodates the six-pad configuration. Consider the 3:4 impedance transformation capability relative to source and load impedances. Verify that the low-profile construction meets mechanical constraints of the final assembly.

Balun Part Context

This device belongs to the BCM3225F3SF series from TAI-TECH, which focuses on miniaturized RF components. The manufacturer specializes in laminated chips and precision wire-wound products. The series addresses the need for small-size solutions in modern radio frequency applications requiring reliable signal conversion.

Balun Replacement Considerations

Check TAI-TECH datasheets for other BCM3225F3SF variants with different impedance ratios or frequency ranges. Verify pin compatibility and footprint dimensions before substituting with generic baluns. Ensure any alternative maintains the 1210 package size and six-pad configuration.

BCM 3225F3SF-75034-1R5-CT1-PBCM 3225F3SF-75034-1R5-CT1-P
$1.33
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