BCM53156XMB0KFBG

Overview

The BCM53156XMB0KFBG is an Ethernet switch integrated circuit from the Broadcom RoboSwitch family. It features eight 10/100/1000BASE-T ports and one 10GBASE-X SFP+ uplink port. The device supports IEEE 802.3 standards including 10/100/1000 Base-T/TX PHYs. It includes GPIO, I2C, MII, and SPI interfaces for control and management. The component operates within a commercial temperature range of 0°C to 70°C.

Feature Summary

• Integrates eight Gigabit Ethernet ports with built-in PHY transceivers
• Provides a single 10 Gigabit Ethernet uplink via SFP+ interface
• Supports hardware-based Layer 2 switching functions without external CPU dependency

Applications

• Enterprise access layer switches
• High-performance wireless LAN controllers
• Fiber-to-the-x (FTTx) aggregation nodes

Procurement Notes

Verify the exact suffix against official Broadcom documentation to confirm package type and temperature grade. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Ensure supply chain sources provide valid traceability documents matching the manufacturer's part number specifications.

Selection Notes

Select this model when a combination of multiple copper Gigabit ports and a high-speed fiber uplink is required. It is suitable for designs needing standalone switching capabilities with minimal external control logic. Compare against other RoboSwitch variants based on specific port counts and uplink speeds.

Part Context

This component belongs to the Broadcom BCM531xx series of RoboSwitch devices. These chips are designed for cost-effective, high-density switching applications. The XMB suffix typically denotes a specific package configuration and thermal rating within the broader BCM53156 product line.