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The BCM53156XUB1KFBG is a highly integrated Layer 2 Ethernet switch from the Broadcom RoboSwitch™ family, built on a 28 nm architecture. It features up to eight 10/100/1000BASE-T ports with integrated ultra-low-power GPHYs and supports up to two 10G XFI interfaces with KR support. The device includes an ARM Cortex-M7 processor operating at up to 400 MHz for protocol handling. It operates within a commercial temperature range of 0°C to +70°C and utilizes a 311-pin FBGA package measuring 13x13 mm².
Verify the specific ordering suffix against official documentation to confirm the exact temperature grade and package variant. Confirm that the component meets RoHS3 compliance standards required for your manufacturing process. Ensure proper ESD handling procedures are followed during assembly due to the fine-pitch FBGA packaging.
Select this model when a balance of Gigabit copper connectivity and high-speed 10G uplink capability is required. It is suitable for designs needing on-chip processing for network management protocols without external controllers. Consider the 311-pin footprint constraints during PCB layout planning.
This component belongs to the BCM53154/BCM53156/BCM53158 product family. While sharing the same core Robo 2 architecture, the BCM53156 specifically targets configurations with up to eleven total interfaces. It differs from the BCM53154 in pin count and interface density, offering a compact solution for mid-range switching applications.
The BCM53154 and BCM53158 are part of the same family but feature different interface counts and package sizes. Direct substitution requires verification of pin compatibility and port configuration requirements.