BCM53156XUB1KFBG

BCM53156XUB1KFBG

$29.68
  • Description:IC ETHERNET SWITCH GPIO
  • Series:RoboSwitch™

SKU:f375ac4bb303 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC ETHERNET SWITCH GPIO
  • Series:RoboSwitch™
  • Mfr:Broadcom Limited
  • Package:Tray
  • Protocol:Ethernet
  • Function:Switch
  • Interface:GPIO, I2C, MII, SPI
  • Standards:IEEE 802.3, 10/100/1000 Base-T/TX PHY
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:0°C ~ 70°C
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
  • Qualification:-

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BCM53156XUB1KFBG

Overview

The BCM53156XUB1KFBG is a highly integrated Layer 2 Ethernet switch from the Broadcom RoboSwitch™ family, built on a 28 nm architecture. It features up to eight 10/100/1000BASE-T ports with integrated ultra-low-power GPHYs and supports up to two 10G XFI interfaces with KR support. The device includes an ARM Cortex-M7 processor operating at up to 400 MHz for protocol handling. It operates within a commercial temperature range of 0°C to +70°C and utilizes a 311-pin FBGA package measuring 13x13 mm².

Feature Summary

  • Supports Unmanaged, Web-Managed, and Managed operational modes for flexible deployment.
  • Integrates an ARM Cortex-M7 CPU for on-chip execution of xSTP, LLDP, and IGMP protocols.
  • Provides advanced traffic management via srTCM/trTCM meters, per-port shapers, and eight CoS queues.
  • Includes robust security mechanisms such as IEEE 802.1x port authentication and DoS filtering.

Applications

  • SMB switches requiring 10G uplinks
  • Enterprise routers and security appliances
  • Next-generation Industrial Ethernet switches

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm the exact temperature grade and package variant. Confirm that the component meets RoHS3 compliance standards required for your manufacturing process. Ensure proper ESD handling procedures are followed during assembly due to the fine-pitch FBGA packaging.

Selection Notes

Select this model when a balance of Gigabit copper connectivity and high-speed 10G uplink capability is required. It is suitable for designs needing on-chip processing for network management protocols without external controllers. Consider the 311-pin footprint constraints during PCB layout planning.

Part Context

This component belongs to the BCM53154/BCM53156/BCM53158 product family. While sharing the same core Robo 2 architecture, the BCM53156 specifically targets configurations with up to eleven total interfaces. It differs from the BCM53154 in pin count and interface density, offering a compact solution for mid-range switching applications.

Replacement Considerations

The BCM53154 and BCM53158 are part of the same family but feature different interface counts and package sizes. Direct substitution requires verification of pin compatibility and port configuration requirements.

BCM53156XUB1KFBGBCM53156XUB1KFBG
$29.68
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