SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The BCM53346A0KFSBLG is a smart switch controller manufactured by Broadcom Limited, designed for high-density Ethernet networking applications. This component integrates 24 Gigabit Ethernet ports and 4 10-Gigabit Ethernet uplink ports within a single integrated circuit package. It belongs to the BCM53346 product family and is classified as an interface controller IC. The device supports RoHS3 compliance and operates under MSL level 1 conditions. It is currently listed as an active product in production, intended for deployment in enterprise and industrial switching environments requiring mixed-speed port configurations.
Verify the specific ordering suffix KFSBLG against the manufacturer's current datasheet to confirm pinout compatibility and temperature range specifications. Confirm that the required quantity aligns with the manufacturer's standard packaging constraints, which may involve tray quantities. Ensure that the source documentation explicitly identifies this part number as an active component to avoid obsolescence risks during long-term projects.
Select this component when a design requires a balance of high port density and high-speed uplink capability without external PHYs for the gigabit ports. Compare against other members of the BCM53346 family to determine if alternative suffixes offer different thermal or packaging options suitable for the target enclosure. Validate that the system power budget accommodates the thermal output associated with 28-port switching operations.
This part is a variant within the Broadcom BCM53346 series, which focuses on smart switching solutions. The base model BCM53346 defines the core switching fabric and port architecture. The specific suffix indicates the package type, operating temperature range, and potentially lead-free processing standards defined by Broadcom Limited for this specific procurement channel.
The BCM53346A0IFSBLG shares the same core functionality and port configuration (24xGE + 4x10G) but features a different suffix indicating distinct packaging or thermal characteristics. Verify mechanical footprint and thermal dissipation requirements before substituting between these variants.