BCM53570B0KFSBG

Overview

The BCM53570B0KFSBG is a System on Chip (SoC) from Broadcom Limited, categorized under RF integrated circuits. It functions as a Layer 2 switch with 24 ports supporting 10 Gigabit Ethernet speeds. The component is designated for commercial temperature operation (C-temp). Manufactured using Silicon technology, it is part of the Broadcom/Avago product line and complies with RoHS standards. The device is supplied in a factory pack quantity of 189 units.

Feature Summary

• Integrated Layer 2 switching functionality
• 24 ports with 10 Gigabit Ethernet capability
• Commercial temperature rating (C-temp)
• Silicon-based System on Chip architecture

Applications

• High-density enterprise network switches
• Data center access layer infrastructure
• Telecommunications equipment requiring 10G uplinks

Procurement Notes

Verify the specific suffix KFSBG against official datasheets to confirm the commercial temperature grade and package type. Ensure compatibility with existing board designs regarding pinout and power requirements. Confirm current production status and availability through authorized channels, as supply chain conditions may vary.

Selection Notes

Select this model when a 24-port 10G L2 switch solution is required within commercial temperature limits. Compare against the B0IFSBG variant if industrial temperature range (-40°C to +85°C) is necessary instead of commercial. Validate that the silicon technology and form factor meet the target hardware constraints.

Part Context

This component belongs to the Broadcom BCM53570 series of wireless and RF integrated circuits. It shares the core 24x10G L2 switching architecture with other variants like the BCM53570B0IFSBG, differing primarily in environmental ratings and packaging specifications defined by the ordering suffix.

Replacement Considerations

The BCM53570B0IFSBG serves as a direct functional alternative within the same family, offering identical switching capabilities but with an extended industrial temperature range. Verify pin-to-pin compatibility and thermal management requirements before substitution.