ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：24 PORT FE MULTI LAYER SWITCH
- Series：*
- Mfr：Broadcom Limited
- Package：Tray
- Protocol：-
- Function：-
- Interface：-
- Standards：-
- Voltage - Supply：-
- Current - Supply：-
- Operating Temperature：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
Download product information
Overview
The BCM56026B0IPBG is a 24-port Fast Ethernet multi-layer switch integrated circuit manufactured by Broadcom Limited. It supports Layer 3 switching capabilities and operates within the communication and networking ICs category. The device is designed for high-density access applications, providing managed Gigabit Ethernet functionality. It features a standard package quantity of 1,134 pieces in tray packaging. The component complies with RoHS3 standards and is classified under moisture sensitivity level 1.
Feature Summary
- Supports 24-port Fast Ethernet connectivity
- Enables Layer 3 multi-layer switching operations
- Provides managed network interface control
Applications
- High-density network access layers
- Enterprise telecommunications infrastructure
- Managed Ethernet switching nodes
Procurement Notes
Verify the specific suffix IPBG against official Broadcom documentation to confirm pinout and package configuration. Confirm current availability status as distribution channels may report varying stock levels or lead times. Ensure compliance with RoHS3 requirements for your target assembly process. Cross-reference the datasheet revision date to ensure compatibility with existing design specifications.
Selection Notes
Select this component when a fixed 24-port Fast Ethernet solution with Layer 3 capabilities is required. Consider the 1,134-piece tray packaging constraint for mass production volumes. Evaluate thermal management requirements for the specific package type. Compare against newer Broadcom silicon generations for potential performance improvements if port speed flexibility is needed.
Part Context
This part belongs to the Broadcom BCM56xxx series of Ethernet switches, targeting carrier-grade and enterprise access markets. It complements higher-speed models like the BCM56260 by offering cost-effective Fast Ethernet density. The IPBG suffix typically denotes a specific ball grid array package variant optimized for surface-mount assembly in telecom equipment.
Replacement Considerations
Check Broadcom's official obsolescence notices for this specific revision. Potential substitutes include newer Broadcom Ethernet switch families with enhanced throughput. Verify pin-to-pin compatibility if replacing in existing designs without board layout changes.
